AD7829BRW-1 [ADI]
3 V/5 V, 2 MSPS, 8-Bit, 8-Channel ADC; 3 V / 5 V ， 2 MSPS ， 8位， 8通道ADC
| 型号： | AD7829BRW-1 |
| 厂家： | 
ADI |
| 描述： | 3 V/5 V, 2 MSPS, 8-Bit, 8-Channel ADC |
| 文件： | 总20页 (文件大小：388K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
3 V/5 V, 2 MSPS, 8-Bit, 8-Channel ADC
AD7829-1
FEATURES
FUNCTIONAL BLOCK DIAGRAM
V
8-bit half-flash ADC with 420 ns conversion time
Eight single-ended analog input channels
Available with input offset adjust
On-chip track-and-hold
SNR performance given for input frequencies
up to10 MHz
DD
CONVST EOC A0 A1 A2
CONTROL
LOGIC
COMP
BUF
2.5V
REF
V
V
V
V
V
V
V
V
IN1
IN2
IN3
IN4
IN5
IN6
IN7
IN8
V
REF IN/OUT
On-chip reference (2.5 V)
8-BIT
INPUT
MUX
HALF
FLASH
ADC
Automatic power-down at the end of conversion
Wide operating supply range
3 V 10% and 5 V 10%
T/H
DB7
DB0
PARALLEL
PORT
Input ranges
0 V to 2 V p-p, VDD = 3 V 10%
0 V to 2.5 V p-p, VDD = 5 V 10%
V
AGND DGND
MID
CS RD
Figure 1.
EOC
Flexible parallel interface with
stand-alone operation
pulse to allow
APPLICATIONS
Data acquisition systems, DSP front ends
Disk drives
Mobile communication systems, subsampling
applications
GENERAL DESCRIPTION
The AD7829-1 is a high speed 8-channel, microprocessor-
compatible, 8-bit analog-to-digital converter with a maximum
throughput of 2 MSPS. The AD7829-1 contains an on-chip
reference of 2.5 V (2% tolerance); a track-and-hold amplifier;
a 420 ns, 8-bit half-flash ADC; and a high speed parallel
interface. The converter can operate from a single 3 V 10%
and 5 V 10% supply.
The AD7829-1 is available in a 28-lead, wide body, small outline
IC (SOIC_W) and a 28-lead thin shrink small outline package
(TSSOP).
PRODUCT HIGHLIGHTS
1. Fast Conversion Time. The AD7829-1 has a conversion
time of 420 ns. Faster conversion times maximize the DSP
processing time in a real-time system.
The AD7829-1 combines the convert start and power-down
2. Analog Input Span Adjustment. The VMID pin allows the
user to offset the input span. This feature can reduce the
requirements of single-supply op amps and take into
account any system offsets.
CONVST
functions at one pin, that is, the
pin. This allows a
unique automatic power-down at the end of a conversion to be
CONVST
implemented. The logic level on the
pin is sampled
EOC
after the end of a conversion when an
(end of conversion)
3. FPBW (Full Power Bandwidth) of Track-and-Hold. The
track-and-hold amplifier has excellent high frequency
performance. The AD7829-1 is capable of converting full-
scale input signals up to a frequency of 10 MHz, making
the parts ideally suited to subsampling applications.
signal goes high, and if it is logic low at that point, the ADC is
powered down. The parallel interface is designed to allow easy
interfacing to microprocessors and DSPs. Using only address
decoding logic, the parts are easily mapped into the microprocessor
address space.
4. Channel Selection. Channel selection is made without the
necessity of writing to the part.
EOC
The
pulse allows the ADCs to be used in a stand-alone
manner (see the Parallel Interface section).
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2006 Analog Devices, Inc. All rights reserved.
AD7829-1
TABLE OF CONTENTS
Features .............................................................................................. 1
Typical Connection Diagram ................................................... 10
ADC Transfer Function............................................................. 11
Analog Input ............................................................................... 11
Power-Up Times......................................................................... 14
Power vs. Throughput................................................................ 14
Operating Modes........................................................................ 15
Parallel Interface......................................................................... 17
Microprocessor Interfacing........................................................... 18
AD7829-1 to 8051 ...................................................................... 18
AD7829-1 to PIC16C6x/PIC16C7x......................................... 18
AD7829-1 to ADSP-21xx.......................................................... 18
Interfacing Multiplexer Address Inputs .................................. 18
Outline Dimensions....................................................................... 20
Ordering Guide .......................................................................... 20
Applications....................................................................................... 1
General Description......................................................................... 1
Functional Block Diagram .............................................................. 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Timing Characteristics ................................................................ 5
Timing Diagram ........................................................................... 5
Absolute Maximum Ratings............................................................ 6
ESD Caution.................................................................................. 6
Pin Configuration and Function Descriptions............................. 7
Terminology ...................................................................................... 8
Circuit Information........................................................................ 10
Circuit Description..................................................................... 10
REVISION HISTORY
7/06—Revision 0: Initial Version
Rev. 0 | Page 2 of 20
AD7829-1
SPECIFICATIONS
VDD = 3 V 10%, VDD = 5 V 10%, GND = 0 V, VREF IN/OUT = 2.5 V. All specifications −40°C to +85°C, unless otherwise noted.
Table 1.
Parameter
Version B
Unit
Test Conditions/Comments
DYNAMIC PERFORMANCE
Signal to (Noise + Distortion) Ratio1
Total Harmonic Distortion1
Peak Harmonic or Spurious Noise1
Intermodulation Distortion1
2nd Order Terms
fIN = 30 kHz, fSAMPLE = 2 MHz
48
−55
−55
dB min
dB max
dB max
fa = 27.3 kHz, fb = 28.3 kHz
fIN = 20 kHz
−65
−65
−70
dB typ
dB typ
dB typ
3rd Order Terms
Channel-to-Channel Isolation1
DC ACCURACY
Resolution
Minimum Resolution for Which
8
8
Bits
Bits
No Missing Codes Are Guaranteed
Integral Nonlinearity (INL)1
Differential Nonlinearity (DNL)1
Gain Error1
0.75
0.75
2
0.1
1
LSB max
LSB max
LSB max
LSB typ
LSB max
LSB typ
Gain Error Match1
Offset Error1
Offset Error Match1
ANALOG INPUTS2
0.1
See Analog Input section
Input voltage span = 2.5 V
VDD = 5 V 10ꢀ
VIN1 to VIN8 Input Voltage
VDD
0
VDD − 1.25
1.25
V max
V min
V max
V min
VMID Input Voltage
Default VMID = 1.25 V
VDD = 3 V 10ꢀ
Input voltage span = 2 V
VIN1 to VIN8 Input Voltage
VDD
0
V max
V min
VMID Input Voltage
VDD − 1
1
V max
V min
Default VMID = 1 V
VIN Input Leakage Current
VIN Input Capacitance
VMID Input Impedance
REFERENCE INPUT
1
15
6
μA max
pF max
kΩ typ
VREF IN/OUT Input Voltage Range
2.55
2.45
1
V max
V min
ꢁA typ
ꢁA max
2.5 V + 2ꢀ
2.5 V − 2ꢀ
Input Current
100
ON-CHIP REFERENCE
Reference Error
Temperature Coefficient
LOGIC INPUTS
Nominal 2.5 V
50
50
mV max
ppm/°C typ
Input High Voltage, VINH
Input Low Voltage, VINL
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IIN
2.4
0.8
2
0.4
1
V min
V max
V min
V max
ꢁA max
pF max
VDD = 5 V 10ꢀ
VDD = 5 V 10ꢀ
VDD = 3 V 10ꢀ
VDD = 3 V 10ꢀ
Typically 10 nA, VIN = 0 V to VDD
Input Capacitance, CIN
10
Rev. 0 | Page 3 of 20
AD7829-1
Parameter
Version B
Unit
Test Conditions/Comments
LOGIC OUTPUTS
Output High Voltage, VOH
ISOURCE = 200 ꢁA
VDD = 5 V 10ꢀ
VDD = 3 V 10ꢀ
ISINK = 200 ꢁA
4
2.4
V min
V min
Output Low Voltage, VOL
0.4
0.2
1
V max
V max
ꢁA max
pF max
VDD = 5 V 10ꢀ
VDD = 3 V 10ꢀ
High Impedance Leakage Current
High Impedance Capacitance
CONVERSION RATE
10
Track/Hold Acquisition Time
Conversion Time
200
420
ns max
ns max
See Circuit Description section
POWER SUPPLY REJECTION
VDD 10ꢀ
1
LSB max
POWER REQUIREMENTS
VDD
4.5
5.5
2.7
3.3
V min
V max
V min
V max
5 V 10ꢀ% for specified performance
3 V 10ꢀ% for specified performance
VDD
IDD
Normal Operation
Power-Down
12
5
0.2
mA max
ꢁA max
ꢁA typ
8 mA typically
Logic inputs = 0 V or VDD
Power Dissipation
Normal Operation
Power-Down
200 kSPS
VDD = 3 V
Typically 24 mW
36
mW max
9.58
23.94
mW typ
mW typ
500 kSPS
1 See the Terminology section of this data sheet.
2 Refer to the Analog Input section for an explanation of the analog input(s).
Rev. 0 | Page 4 of 20
AD7829-1
TIMING CHARACTERISTICS
VREF IN/OUT = 2.5 V. All specifications −40°C to +85°C, unless otherwise noted.
Table 2.
Parameter1, 2 5 V 10% 3 V 10% Unit
Description
t1
t2
t3
t4
420
20
30
110
70
10
0
420
20
30
110
70
10
0
ns max Conversion time
ns min Minimum CONVST pulse width
ns min Minimum time between the rising edge of RD and the next falling edge of convert start
ns max EOC pulse width
ns min
t5
t6
t7
t8
t9
ns max RD rising edge to EOC pulse high
ns min CS to RD setup time
0
0
ns min CS to RD hold time
30
10
5
30
20
5
ns min Minimum RD pulse width
3
ns max Data access time after RD low
ns min Bus relinquish time after RD high
ns max
ns min Address setup time before the falling edge of RD
ns min Address hold time after the falling edge of RD
ns min Minimum time between new channel selection and convert start
4
t10
20
10
15
200
25
1
20
10
15
200
25
1
t11
t12
t13
tPOWER UP
tPOWER UP
μs typ
Power-up time from the rising edge of CONVST using on-chip reference
μs max Power-up time from the rising edge of CONVST using external 2.5 V reference
1 Sample tested to ensure compliance.
2 See Figure 21, Figure 22, and Figure 23.
3 Measured with the load circuit of Figure 2 and defined as the time required for an output to cross 0.8 V or 2.4 V with VDD = 5 V 10ꢀ, and the time required for an
output to cross 0.4 V or 2.0 V with VDD = 3 V 10ꢀ.
4 Derived from the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 2. The measured number is then extrapolated back
to remove the effects of charging or discharging the 50 pF capacitor. This means that the time, t10, quoted in the timing characteristics is the true bus relinquish time
of the part and, as such, is independent of external bus loading capacitances.
TIMING DIAGRAM
200µA
I
OL
TO OUTPUT
PIN
2.1V
C
L
50pF
200µA
I
OH
Figure 2. Load Circuit for Access Time and Bus Relinquish Time
Rev. 0 | Page 5 of 20
AD7829-1
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Parameter
Rating
VDD to AGND
VDD to DGND
−0.3 V to +7 V
−0.3 V to +7 V
Analog Input Voltage to AGND
VIN1 to VIN8
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
Reference Input Voltage to AGND
VMID Input Voltage to AGND
Digital Input Voltage to DGND
Digital Output Voltage to DGND
Operating Temperature Range
Industrial (B Version)
Storage Temperature Range
Junction Temperature
SOIC Package, Power Dissipation
θJA Thermal Impedance
Lead Temperature, Soldering
Vapor Phase (60 sec)
−40°C to +85°C
−65°C to +150°C
150°C
450 mW
75°C/W
215°C
Infrared (15 sec)
220°C
TSSOP Package, Power Dissipation
θJA Thermal Impedance
Lead Temperature, Soldering
Vapor Phase (60 sec)
450 mW
128°C/W
215°C
220°C
1 kV
Infrared (15 sec)
ESD
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. 0 | Page 6 of 20
AD7829-1
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
DB2
1
2
3
4
5
6
7
8
9
28 DB3
27 DB4
26 DB5
25 DB6
24 DB7
23 AGND
DB1
DB0
CONVST
CS
AD7829-1
RD
TOP VIEW
DGND
EOC
A2
22
21
20
19
18
17
16
15
V
V
V
V
V
V
V
V
DD
(Not to Scale)
REF IN/OUT
MID
A1 10
A0 11
IN1
IN2
V
V
V
12
13
14
IN8
IN7
IN6
IN3
IN4
IN5
Figure 3. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic
Description
12 to 19 VIN8 to VIN1
Analog Input Channels. The AD7829-1 has eight analog input channels. The inputs have an input span of 2.5 V
and 2 V, depending on the supply voltage (VDD). This span can be centered anywhere in the range AGND to VDD
using the VMID pin. The default input range (VMID unconnected) is AGND to 2 V (VDD = 3 V 10ꢀ) or AGND to 2.5 V
(VDD = 5 V 10ꢀ). See the Analog Input section of the data sheet for more information.
22
23
7
VDD
Positive Supply Voltage, 3 V 10ꢀ and 5 V 10ꢀ.
Analog Ground. Ground reference for track/hold, comparators, reference circuit, and multiplexer.
Digital Ground. Ground reference for digital circuitry.
Logic Input Signal. The convert start signal initiates an 8-bit analog-to-digital conversion on the falling edge
of this signal. The falling edge of this signal places the track/hold in hold mode. The track/hold goes into track
mode again 120 ns after the start of a conversion. The state of the CONVST signal is checked at the end of a
conversion. If it is logic low, the AD7829-1 powers down (see the Operating Modes section).
AGND
DGND
CONVST
4
8
EOC
Logic Output. The end of conversion signal indicates when a conversion has finished. The signal can be used
to interrupt a microcontroller when a conversion has finished or latch data into a gate array (see the Parallel
Interface section).
5
6
CS
Logic Input Signal. The chip select signal is used to enable the parallel port of the AD7829. This is necessary
if the ADC is sharing a common data bus with another device.
Logic Input Signal. The read signal is used to take the output buffers out of their high impedance state and drive
data onto the data bus. The signal is internally gated with the CS signal. Both RD and CS must be logic low to
enable the data bus.
RD
9 to 11
1 to 3,
A2 to A0
Channel Address Inputs. The address of the next multiplexer channel must be present on these inputs when
the RD signal goes low.
DB2 to DB0,
Data Output Lines. They are normally held in a high impedance state. Data is driven onto the data bus when
both RD and CS go active low.
24 to 28 DB7 to DB3
21
VREF IN/OUT
Analog Input and Output. An external reference can be connected to the AD7829-1 at this pin. The on-chip
reference is also available at this pin. When using the internal reference, this pin can be left unconnected or,
in some cases, it can be decoupled to AGND with a 0.1 μF capacitor.
20
VMID
The VMID pin, if connected, is used to center the analog input span anywhere in the range of AGND to VDD
(see the Analog Input section).
Rev. 0 | Page 7 of 20
AD7829-1
TERMINOLOGY
As a result, the second and third order terms are specified
separately. The calculation of the intermodulation distortion is
as per the THD specification, where it is the ratio of the rms
sum of the individual distortion products to the rms amplitude
of the fundamental expressed in decibels (dB).
Signal-to-(Noise + Distortion) Ratio
The measured ratio of signal-to-(noise + distortion) at the
output of the A/D converter. The signal is the rms amplitude of
the fundamental. Noise is the rms sum of all nonfundamental
signals up to half the sampling frequency (fS/2), excluding dc.
The ratio is dependent upon the number of quantization levels
in the digitization process; the more levels, the smaller the
quantization noise. The theoretical signal-to-(noise +
distortion) ratio for an ideal N-bit converter with a sine wave
input is given by
Channel-to-Channel Isolation
A measure of the level of crosstalk between channels. It is
measured by applying a full-scale 20 kHz sine wave signal to
one input channel and determining how much that signal is
attenuated in each of the other channels. The figure given is
the worst case across all eight channels of the AD7829-1.
Signal-to-(Noise + Distortion) = (6.02N + 1.76) dB
Thus, for an 8-bit converter, this is 50 dB.
Relative Accuracy or Endpoint Nonlinearity
The maximum deviation from a straight line passing through
the endpoints of the ADC transfer function.
Total Harmonic Distortion (THD)
The ratio of the rms sum of harmonics to the fundamental.
For the AD7829-1 it is defined as
Differential Nonlinearity
2
V22 +V32 +V42 +V52 +V6
The difference between the measured and the ideal 1 LSB
change between any two adjacent codes in the ADC.
THD (dB) = 20 log
V1
Offset Error
where V1 is the rms amplitude of the fundamental, and V2, V3,
V4, V5, and V6 are the rms amplitudes of the second through the
sixth harmonics.
The deviation of the 128th code transition (01111111) to
(10000000) from the ideal, that is, VMID
.
Offset Error Match
The difference in offset error between any two channels.
Peak Harmonic or Spurious Noise
The ratio of the rms value of the next largest component in the
ADC output spectrum (up to fS/2 and excluding dc) to the rms
value of the fundamental. Normally, the value of this specifica-
tion is determined by the largest harmonic in the spectrum,
but for parts where the harmonics are buried in the noise floor,
it will be a noise peak.
Zero-Scale Error
The deviation of the first code transition (00000000) to
(00000001) from the ideal; that is, VMID − 1.25 V + 1 LSB (VDD
5 V 10%), or VMID − 1.0 V + 1 LSB (VDD = 3 V 10%).
=
=
Full-Scale Error
Intermodulation Distortion
The deviation of the last code transition (11111110) to
(11111111) from the ideal; that is, VMID + 1.25 V − 1 LSB (VDD
5 V 10%), or VMID + 1.0 V − 1 LSB (VDD = 3 V 10%).
With inputs consisting of sine waves at two frequencies, fa and
fb, any active device with nonlinearities creates distortion
products at sum and difference frequencies of mfa nfb, where
m, n = 0, 1, 2, 3… . Intermodulation terms are those for which
neither m nor n is equal to zero. For example, the second order
terms include (fa + fb) and (fa − fb), while the third order terms
include (2fa + fb), (2fa − fb), (fa + 2fb), and (fa − 2fb). The
AD7829-1 is tested using the CCIF standard, where two input
frequencies near the top end of the input bandwidth are used.
In this case, the second and third order terms are of different
significance. The second order terms are usually distanced in
frequency from the original sine waves, while the third order
terms are usually at a frequency close to the input frequencies.
Gain Error
The deviation of the last code transition (1111 . . . 110) to
(1111 . . . 111) from the ideal; that is, VREF − 1 LSB, after the
offset error has been adjusted out.
Gain Error Match
The difference in gain error between any two channels.
Rev. 0 | Page 8 of 20
AD7829-1
It means that the user must wait for the duration of the
Track/Hold Acquisition Time
track/hold acquisition time after a channel change/step input
change to VIN before starting another conversion, to ensure that
the part operates to specification.
The time required for the output of the track/hold amplifier to
reach its final value, within 1/2 LSB, after the point at which
the track/hold returns to track mode. This happens approxi-
CONVST
mately 120 ns after the falling edge of
.
PSR (Power Supply Rejection)
Variations in power supply affect the full-scale transition
but not the converter’s linearity. Power supply rejection is the
maximum change in the full-scale transition point due to a
change in power supply voltage from the nominal value.
It also applies to situations where a change in the selected input
channel takes place or where there is a step input change on the
input voltage applied to the selected VIN input of the AD7829-1.
Rev. 0 | Page 9 of 20
AD7829-1
CIRCUIT INFORMATION
CIRCUIT DESCRIPTION
REFERENCE
The AD7829-1 consists of a track-and-hold amplifier followed
by a half-flash analog-to-digital converter. These devices use a
half-flash conversion technique where one 4-bit flash ADC is
used to achieve an 8-bit result. The 4-bit flash ADC contains a
sampling capacitor followed by 15 comparators that compare
the unknown input to a reference ladder to achieve a 4-bit result.
This first flash, that is, coarse conversion, provides the four
MSBs. For a full 8-bit reading to be realized, a second flash,
that is, a fine conversion, must be performed to provide the four
LSBs. The 8-bit word is then placed on the data output bus.
R16
R15
15
14
13
D7
D6
D5
D4
D3
D2
D1
D0
SW2
A
T/H 1
V
IN
SAMPLING
CAPACITOR
B
HOLD
R14
R13
Figure 4 and Figure 5 show simplified schematics of the ADC.
When the ADC starts a conversion, the track-and-hold goes
into hold mode and holds the analog input for 120 ns. This is
the acquisition phase as shown in Figure 4, when Switch 2 is in
Position A. At the point when the track-and-hold returns to its
track mode, this signal is sampled by the sampling capacitor as
Switch 2 moves into Position B. The first flash occurs at this
instant and is then followed by the second flash. Typically, the
first flash is complete after 100 ns, that is, at 220 ns, while the
end of the second flash and, hence, the 8-bit conversion result,
is available at 330 ns (minimum). The maximum conversion
time is 420 ns. As shown in Figure 6, the track-and-hold returns
to track mode after 120 ns and starts the next acquisition before
the end of the current conversion. Figure 8 shows the ADC
transfer function.
1
R1
TIMING AND
CONTROL
LOGIC
Figure 5. ADC Conversion Phase
120ns
HOLD
TRACK
TRACK
HOLD
CONVST
t2
t1
EOC
CS
t3
RD
VALID
DATA
DB0 TO DB7
REFERENCE
Figure 6. Track-and-Hold Timing
TYPICAL CONNECTION DIAGRAM
Figure 7 shows a typical connection diagram for the AD7829-1.
The AGND and DGND are connected together at the device for
good noise suppression. The parallel interface is implemented
R16
15
D7
D6
R15
SW2
A
D5
EOC
using an 8-bit data bus. The end of conversion signal ( ) idles
14
13
T/H 1
V
IN
SAMPLING
CAPACITOR
B
D4
D3
D2
D1
D0
CONVST
initiates a conversion, and at
high, the falling edge of
HOLD
EOC
the end of conversion the falling edge of
is used to initiate
R14
R13
an interrupt service routine (ISR) on a microprocessor (see the
Parallel Interface section). VREF IN/OUT and VMID are connected to a
voltage source, such as the AD780, while VDD is connected to a
voltage source that can vary from 4.5 V to 5.5 V (see Table 5 in
the Analog Input section). When VDD is first connected, the
AD7829-1 powers up in a low current mode, that is, power-down.
1
R1
TIMING AND
CONTROL
LOGIC
CONVST
Ensure that the
line is not floating when VDD is applied,
because this can put the AD7829-1 into an unknown state.
Figure 4. ADC Acquisition Phase
Rev. 0 | Page 10 of 20
AD7829-1
CONVST
A suggestion is to tie
to VDD or DGND through a
CONVST
ANALOG INPUT
pull-up or pull-down resistor. A rising edge on the
The AD7829-1 has eight input channels. Each input channel has
an input span of 2.5 V or 2.0 V, depending on the supply voltage
(VDD). This input span is automatically set up by an on-chip
“VDD detector” circuit. A 5 V operation of the ADCs is detected
when VDD exceeds 4.1 V, and a 3 V operation is detected when
pin causes the AD7829-1 to fully power up. For applications
where power consumption is of concern, the automatic power-
down at the end of a conversion should be used to improve
power performance (see the Power vs. Throughput section).
If the AD7829-1 is operated outside normal VDD limits (for
example, a brown-out), it may take two conversions to reset the
part once the correct VDD has been established.
VDD falls below 3.8 V. This circuit also possesses a degree of
glitch rejection; for example, a glitch from 5.5 V to 2.7 V up to
60 ns wide does not trip the VDD detector.
2.5V
AD780
The VMID pin is used to center this input span anywhere in the
SUPPLY
4.5V TO 5.5V
range of AGND to VDD. If no input voltage is applied to VMID
,
10µF
0.1µF
PARALLEL
INTERFACE
the default input range is AGND to 2.0 V (VDD = 3 V 10%),
that is, centered about 1.0 V; or AGND to 2.5 V (VDD = 5 V 10%),
that is, centered about 1.25 V. When using the default input range,
the VMID pin can be left unconnected; or, in some cases, it can be
decoupled to AGND with a 0.1 μF capacitor.
V
V
V
DD
REF
MID
DB0 TO DB7
EOC
V
IN1
1.25V TO
3.75V INPUT
RD
V
IN2
AD7829-1
CS
If, however, an external VMID is applied, the analog input range
is from VMID − 1.0 V to VMID + 1.0 V (VDD = 3 V 10%), or from
µC/µP
CONVST
A0
V
IN8
VMID − 1.25 V to VMID + 1.25 V (VDD = 5 V 10%).
AGND
DGND
The range of values of VMID that can be applied depends on the
value of VDD. For VDD = 3 V 10%, the range of values that can
be applied to VMID is from 1.0 V to VDD − 1.0 V and is 1.25 V to
A1
A2
V
DD − 1.25 V when VDD = 5 V 10%. Table 5 shows the relevant
ranges of VMID and the input span for various values of VDD
Figure 9 illustrates the input signal range available with various
.
Figure 7. Typical Connection Diagram
ADC TRANSFER FUNCTION
values of VMID
.
The output coding of the AD7829-1 is straight binary. The
designed code transitions occur at successive integer LSB values
(that is, 1 LSB, 2 LSBs, and so on). The LSB size is equal to
Table 5.
VMID
VMID Ext
VMID Ext
VDD Internal Maximum VIN Span Minimum VIN Span
V
REF/256 (VDD = 5 V), or the LSB size is equal to (0.8 VREF)/256
5.5 1.25
5.0 1.25
4.5 1.25
3.3 1.00
3.0 1.00
2.7 1.00
4.25
3.75
3.25
2.3
2.0
1.7
3.0 to 5.5 1.25
2.5 to 5.0 1.25
2.0 to 4.5 1.25
1.3 to 3.3 1.00
1.0 to 3.0 1.00
0.7 to 2.7 1.00
0 to 2.5
0 to 2.5
0 to 2.5
0 to 2.0
0 to 2.0
0 to 2.0
(VDD = 3 V). The ideal transfer characteristic for the AD7829-1
is shown in Figure 8.
(V
= 5V)
DD
1LSB = V
11111111
111...110
/256
REF
111...000
10000000
000...111
(V
= 3V)
DD
1LSB = 0.8V
/256
REF
000...010
000...001
00000000
1LSB
V
MID
(V = 5V) V
DD
(V = 3V) V
DD
– 1.25V
– 1V
V
V
+ 1.25V – 1LSB
+ 1V – 1LSB
MID
MID
MID
MID
ANALOG INPUT VOLTAGE
Figure 8. Transfer Characteristic
Rev. 0 | Page 11 of 20
AD7829-1
2.5V
V
= 5V
DD
V
V
REF
MID
5V
4V
3V
2V
1V
R4
R1
AD7829-1
R3
R2
V
= 3.75V
MID
V
IN
V
V
V
= 2.5V
MID
0V
V
IN
V
= N/C (1.25V)
MID
2.5V
INPUT SIGNAL RANGE
FOR VARIOUS V
MID
0V
Figure 11. Accommodating Bipolar Signals Using External VMID
EXTERNAL
2.5V
V
= 3V
DD
3V
2V
V
REF
V
MID
R4
R1
AD7829-1
R3
R2
V
= 2V
MID
V
IN
V
= 1.5V
V
MID
V
V
= N/C (1V)
MID
1V
0V
V
INPUT SIGNAL RANGE
FOR VARIOUS V
IN
MID
V
MID
Figure 9. Analog Input Span Variation with VMID
0V
VMID can be used to remove offsets in a system by applying the
offset to the VMID pin, as shown in Figure 10; or it can be used
to accommodate bipolar signals by applying VMID to a level-shifting
circuit before VIN, as shown in Figure 11. When VMID is being
driven by an external source, the source can be directly tied to
the level-shifting circuitry (see Figure 11); however, if the internal
Figure 12. Accommodating Bipolar Signals Using Internal VMID
NOTE: Although there is a VREF pin from which a voltage
reference of 2.5 V can be sourced, or to which an external
reference can be applied, this does not provide an option of
varying the value of the voltage reference. As stated in the
specifications for the AD7829-1, the input voltage range at this
pin is 2.5 V 2%.
VMID, that is, the default value, is being used as an output, it must
be buffered before applying it to the level-shifting circuitry, because
the VMID pin has an impedance of approximately 6 kΩ (see
Figure 12).
Analog Input Structure
Figure 13 shows an equivalent circuit of the analog input
structure of the AD7829-1. The two diodes, D1 and D2, provide
ESD protection for the analog inputs. Care must be taken to
ensure that the analog input signal never exceeds the supply
rails by more than 200 mV. This causes these diodes to become
forward biased and start conducting current into the substrate.
20 mA is the maximum current these diodes can conduct
without causing irreversible damage to the part. However, it is
worth noting that a small amount of current (1 mA) conducted
into the substrate due to an overvoltage on an unselected channel
can cause inaccurate conversions on a selected channel.
V
IN
V
IN
V
MID
AD7829-1
V
MID
V
MID
Figure 10. Removing Offsets Using VMID
Rev. 0 | Page 12 of 20
AD7829-1
120ns
Capacitor C2 in Figure 13 is typically about 4 pF and can be
primarily attributed to pin capacitance. The resistor, R1, is a
lumped component made up of the on resistance of several
components, including that of the multiplexer and the track-
and-hold. This resistor is typically about 310 Ω. Capacitor C1
is the track-and-hold capacitor and has a capacitance of 0.5 pF.
Switch 1 is the track-and-hold switch, while Switch 2 is that of
the sampling capacitor, as shown in Figure 4 and Figure 5.
HOLD CHx
TRACK CHx
TRACK CHx
CONVST
TRACK CHy
HOLD CHy
t2
t1
EOC
CS
t3
RD
V
DD
t13
VALID
DATA
DB0 TO DB7
C1
0.5pF
D1
R1
310Ω
SW2
B
A
V
IN
A0 TO A2
SW1
C2
4pF
D2
ADDRESS CHANNEL y
Figure 14. Channel Hopping Timing
Figure 13. Equivalent Analog Input Circuit
RD
There is a minimum time delay between the falling edge of
CONVST
and the next falling edge of the
signal, t13. This is the
When in track phase, Switch 1 is closed and Switch 2 is in
Position A; when in hold mode, Switch 1 opens, while Switch 2
remains in Position A. The track-and-hold remains in hold
mode for 120 ns (see the Circuit Description section), after
which it returns to track mode and the ADC enters its
conversion phase. At this point, Switch 1 opens and Switch 2
moves to Position B. At the end of the conversion, Switch 2
moves back to Position A.
minimum acquisition time required of the track-and-hold to
maintain 8-bit performance. Figure 15 shows the typical
performance of the AD7829-1 when channel hopping for
various acquisition times. These results were obtained using an
external reference and internal VMID while channel hopping
between VIN1 and VIN4 with 0 V on Channel 4 and 0.5 V on
Channel 1.
8.5
Analog Input Selection
8.0
On power-up, the default VIN selection is VIN1. When returning
to normal operation from power-down, the VIN selected is the
same one that was selected prior to power-down being initiated.
Table 6 shows the multiplexer address corresponding to each
analog input from VIN1 to VIN8 for the AD7829-1.
7.5
7.0
6.5
Table 6.
6.0
5.5
5.0
A2
A1
0
0
1
1
0
0
1
1
A0
0
1
0
1
0
1
0
1
Analog Input Selected
0
0
0
0
1
1
1
1
VIN1
VIN2
VIN3
VIN4
VIN5
VIN6
VIN7
VIN8
500
200
100
50
40
30
20
15
10
ACQUISITION TIME (ns)
Figure 15. Effective Number of Bits vs. Acquisition Time for the AD7829-1
The on-chip track-and-hold can accommodate input
frequencies to 10 MHz, making the AD7829-1 ideal for
subsampling applications. When the AD7829-1 is converting a
10 MHz input signal at a sampling rate of 2 MSPS, the effective
number of bits typically remains above seven, corresponding to
a signal-to-noise ratio of 42 dB, as shown in Figure 16.
Channel selection on the AD7829-1 is made without the
necessity of a write operation. The address of the next channel
to be converted is latched at the start of the current read
RD
CS
operation, that is, on the falling edge of
while
is low, as
shown in Figure 14. This allows for improved throughput rates
in “channel hopping” applications.
Rev. 0 | Page 13 of 20
AD7829-1
50
48
46
44
42
40
CONVST
If the falling edge of
occurs after the required power-
fSAMPLE = 2MHz
up time has elapsed, then it is upon this falling edge that a
conversion is initiated. When using the on-chip reference, it is
necessary to wait the required power-up time of approximately
25 μs before initiating a conversion. That is, a falling edge on
must not occur before the required power-up time
has elapsed, when VDD is first connected or after the AD7829-1
CONVST
CONVST
has been powered down using the
Figure 17.
pin, as shown in
POWER VS. THROUGHPUT
38
0.2
1
3
4
5
6
8
10
Superior power performance can be achieved by using the
automatic power-down (Mode 2) at the end of a conversion
(see the Operating Modes section).
INPUT FREQUENCY (MHz)
Figure 16. SNR vs. Input Frequency on the AD7829-1
POWER-UP TIMES
Figure 18 shows how the automatic power-down is implemented
CONVST
using the
signal to achieve the optimum power perform-
CONVST
The AD7829-1 has a 1 μs power-up time when using an
external reference and a 25 ꢀs power-up time when using the
on-chip reference. When VDD is first connected, the AD7829-1
ance for the AD7829-1. The duration of the
pulse is
set to be equal to or less than the power-up time of the devices
(see the Operating Modes section). As the throughput rate is
reduced, the device remains in its power-down state longer, and the
average power consumption over time drops accordingly.
CONVST
is in a low current mode of operation. Ensure that the
line is not floating when VDD is applied. If there is a glitch on
CONVST
while VDD is rising, the part attempts to power up
before VDD has fully settled and may enter an unknown state.
In order to carry out a conversion, the AD7829-1 must first be
powered up.
tPOWER-UP tCONVERT
1µs
POWER-DOWN
330ns
CONVST
EXTERNAL REFERENCE
tCYCLE
10µs @ 100kSPS
V
DD
tPOWER-UP
1µs
Figure 18. Automatic Power-Down
CONVST
For example, if the AD7829-1 is operated in a continuous
sampling mode, with a throughput rate of 100 kSPS and using
an external reference, the power consumption is calculated as
follows. The power dissipation during normal operation is
36 mW, VDD = 3 V. If the power-up time is 1 ꢀs and the conversion
time is 330 ns (@ +25°C), the AD7829-1 can be said to dissipate
36 mW (maximum) for 1.33 μs during each conversion cycle.
If the throughput rate is 100 kSPS, the cycle time is 10 ꢀs and
the average power dissipated during each cycle is (1.33/10) ×
(36 mW) = 4.79 mW. This calculation uses the minimum
conversion time, thus giving the best-case power dissipation at
this throughput rate. However, the actual power dissipated
during each conversion cycle may increase, depending on the
actual conversion time (up to a maximum of 420 ns).
CONVERSION
INITIATED HERE
ON-CHIP REFERENCE
V
DD
tPOWER-UP
25µs
CONVST
CONVERSION
INITIATED HERE
Figure 17. AD7829-1 Power-Up Time
CONVST
The AD7829-1 is powered up by a rising edge on the
pin. A conversion is initiated on the falling edge of
Figure 17 shows how to power up the AD7829-1 when VDD is
first connected or after the AD7829-1 has been powered down
CONVST
.
CONVST
using the
or an external reference. When using an external reference, the
CONVST
pin when using either the on-chip reference
falling edge of
up time has elapsed. However, the conversion is not initiated on
CONVST
may occur before the required power-
the falling edge of
but rather at the moment when the
part has completely powered up, that is, after 1 μs.
Rev. 0 | Page 14 of 20
AD7829-1
Figure 19 shows the power vs. throughput rate for automatic,
full power-down.
OPERATING MODES
The AD7829-1 has two possible modes of operation, depending
CONVST
100
10
1
on the state of the
pulse approximately 100 ns after the
EOC
end of a conversion, that is, upon the rising edge of the
pulse.
Mode 1 Operation (High-Speed Sampling)
When the AD7829-1 is operated in Mode 1, it is not powered
down between conversions. This mode of operation allows high
throughput rates to be achieved. Figure 21 shows how this
CONVST
optimum throughput rate is achieved by bringing
EOC
high before the end of a conversion, that is, before the
0.1
pulses low. When operating in this mode, a new conversion
should not be initiated until 30 ns after the end of a read
operation. This allows the track/hold to acquire the analog
signal to 0.5 LSB accuracy.
0
0
50 100 150 200 250 300 350 400 450 500
THROUGHPUT (kSPS)
Figure 19. AD7829-1 Power vs. Throughput
Mode 2 Operation (Automatic Power-Down)
0
–10
–20
–30
–40
–50
–60
–70
–80
When the AD7829-1 is operated in Mode 2 (see Figure 22), it
automatically powers down at the end of a conversion. The
2048 POINT FFT
SAMPLING
2MSPS
fIN = 200kHz
CONVST
signal is brought low to initiate a conversion and is
EOC
left logic low until after the
goes high, that is, approximately
CONVST
100 ns after the end of the conversion. The state of the
signal is sampled at this point (that is, 530 ns maximum after
CONVST
falling edge) and the AD7829-1 powers down as long
is low. The ADC is powered up again on the rising
CONVST
as
CONVST
edge of the
signal. Superior power performance can
be achieved in this mode of operation by powering up the
AD7829-1 only to carry out a conversion. The parallel interface
of the AD7829-1 is still fully operational while the ADCs are
powered down. A read can occur while the part is powered
down, and so it does not necessarily need to be placed within
FREQUENCY (kHz)
Figure 20. AD7829-1 SNR
EOC
the
pulse, as shown in Figure 22.
120ns
HOLD
TRACK
TRACK
HOLD
t2
CONVST
t1
EOC
CS
t3
RD
VALID
DATA
DB0 TO DB7
Figure 21. Mode 1 Operation
Rev. 0 | Page 15 of 20
AD7829-1
tPOWER-UP
POWER
DOWN
HERE
CONVST
t1
EOC
CS
RD
VALID
DATA
DB0 TO DB7
Figure 22. Mode 2 Operation
Rev. 0 | Page 16 of 20
AD7829-1
EOC
However, the
RD EOC
pulse can be reset high by a rising edge of
PARALLEL INTERFACE
. This
interrupt of a microprocessor.
the 8-bit conversion result. It is possible to tie
RD
line can be used to drive an edge-triggered
The parallel interface of the AD7829-1 is eight bits wide. Figure 23
shows a timing diagram illustrating the operational sequence of
the AD7829-1 parallel interface. The multiplexer address is latched
into the AD7829-1 on the falling edge of the
chip track/hold goes into hold mode on the falling edge of
CS RD
and
going low accesses
CS
permanently
to access the data. In systems where the
EOC
low and use only
part is interfaced to a gate array or ASIC, this
CS RD
RD
input. The on-
pulse can be
inputs to latch data out of the
applied to the
and
CONVST
. A conversion is also initiated at this point. When the
AD7829-1 and into the gate array or ASIC. This means that the
gate array or ASIC does not need any conversion status
recognition logic, and it also eliminates the logic required in the
EOC
) pulses
conversion is complete, the end of conversion line (
low to indicate that new data is available in the output register
EOC
of the AD7829-1. The
time of 110 ns.
pulse stays logic low for a maximum
gate array or ASIC to generate the read signal for the AD7829-1.
t2
CONVST
t1
t4
EOC
CS
t5
t7
t6
t8
t3
RD
t9
t10
VALID
DATA
DB0 TO DB7
t13
t11
t12
NEXT
CHANNEL
ADDRESS
A0 TO A2
Figure 23. AD7829-1 Parallel Port Timing
Rev. 0 | Page 17 of 20
AD7829-1
MICROPROCESSOR INTERFACING
The parallel port on the AD7829-1 allows the ADCs to be
interfaced to a range of many different microcontrollers. This
section explains how to interface the AD7829-1 with some of
the more common microcontroller parallel interface protocols.
AD7829-11
1
PIC16C6x/7x
DB0 TO DB7
CS
PSP0 TO PSP7
CS
AD7829-1 TO 8051
Figure 24 shows a parallel interface between the AD7829-1 and
EOC
the 8051 microcontroller. The
signal on the AD7829-1
RD
RD
provides an interrupt request to the 8051 when a conversion
ends and data is ready. Port 0 of the 8051 can serve as an input
or output port, or, as in this case when used together with the
address latch enable (ALE) of the AD8051, it can be used as a
bidirectional low order address and data bus. The ALE output
of the 8051 is used to latch the low byte of the address during
accesses to the device, while the high order address byte is
supplied from Port 2. Port 2 latches remain stable when the
AD7829-1 is addressed, because they do not have to be turned
around (set to 1) for data input, as is the case for Port 0.
INT
EOC
1
ADDITIONAL PINS OMITTED FOR CLARITY.
Figure 25. Interfacing to the PIC16C6x/PIC16C7x
AD7829-1 TO ADSP-21xx
Figure 26 shows a parallel interface between the AD7829-1 and
EOC
the ADSP-21xx series of DSPs. As before, the
signal on the
AD7829-1 provides an interrupt request to the DSP when a
conversion ends.
1
1
ADSP-21xx
8051
DB0 TO DB7
D7 TO D0
DB0 TO DB7
AD0 TO AD7
A13 TO A0
AD7829-11
LATCH
DECODER
AD7829-11
ADDRESS
DECODE
LOGIC
CS
RD
ALE
A8 TO A15
CS
DMS
EN
RD
RD
RD
INT
EOC
IRQ
EOC
1
ADDITIONAL PINS OMITTED FOR CLARITY.
1
ADDITIONAL PINS OMITTED FOR CLARITY.
Figure 24. Interfacing to the 8051
Figure 26. Interfacing to the ADSP-21xx
AD7829-1 TO PIC16C6x/PIC16C7x
INTERFACING MULTIPLEXER ADDRESS INPUTS
Figure 25 shows a parallel interface between the AD7829-1 and
EOC
Figure 27 shows a simplified interfacing scheme between the
AD7829-1 and any microprocessor or microcontroller that
facilitates easy channel selection on the ADCs. The multiplexer
the PIC16C64/PIC16C65/PIC16C74. The
signal on the
AD7829-1 provides an interrupt request to the microcontroller
when a conversion begins. Of the PIC16C6x/PIC16C7x range of
microcontrollers, only the PIC16C64/PIC16C65/PIC16C74 can
provide the option of a parallel slave port. Port D of the micro-
controller operates as an 8-bit wide parallel slave port when Control
Bit PSPMODE in the TRISE register is set. Setting PSPMODE
RD
address is latched on the falling edge of the
signal, as outlined
in the Parallel Interface section, which allows the use of the three
LSBs of the address bus to select the channel address. As shown in
Figure 27, only Address Bit A3 to Address Bit A15 are address
decoded, allowing A0 to A2 to be changed according to desired
channel selection without affecting chip selection.
RD
CS
enables Port Pin RE0 to be the
output and RE2 to be the
(chip select) output. For this functionality, the corresponding
data direction bits of the TRISE register must be configured as
outputs (reset to 0). See the PIC16C6x/PIC16C7x Microcontroller
User Manual for more information.
Rev. 0 | Page 18 of 20
AD7829-1
MICROPROCESSOR READ CYCLE
AD7829-11
A0
A1
CS
A2
RD
ADDRESS
DECODE
A15 TO A3
CS
ADC I/O ADDRESS
A15 TO A3
RD
A2 TO A0
MUX ADDRESS
A/D RESULT
DB7 TO DB0
DB0 TO DB7
MUX ADDRESS
(CHANNEL SELECTION A0 TO A2)
LATCHED
Figure 27. AD7829-1 Simplified Microinterfacing Scheme
Rev. 0 | Page 19 of 20
AD7829-1
OUTLINE DIMENSIONS
18.10 (0.7126)
17.70 (0.6969)
28
1
15
14
7.60 (0.2992)
7.40 (0.2913)
10.65 (0.4193)
10.00 (0.3937)
0.75 (0.0295)
0
.25 (0.0098)
45°
2.65 (0.1043)
2.35 (0.0925)
0.30 (0.0118)
0.10 (0.0039)
8°
0°
COPLANARITY
0.10
SEATING
PLANE
0.51 (0.0201)
0.31 (0.0122)
1.27 (0.0500)
BSC
1.27 (0.0500)
0.40 (0.0157)
0.33 (0.0130)
0.20 (0.0079)
COMPLIANT TO JEDEC STANDARDS MS-013-AE
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 28. 28-Lead Standard Small Outline Package [SOIC_W]
Wide Body
(RW-28)
Dimensions shown in millimeters and (inches)
9.80
9.70
9.60
28
15
4.50
4.40
4.30
6.40 BSC
1
14
PIN 1
0.65
BSC
1.20 MAX
0.15
0.05
8°
0°
0.75
0.60
0.45
0.30
0.19
0.20
0.09
SEATING
PLANE
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AE
Figure 29. 28-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-28)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range Package Description
Package Option Linearity Error
AD7829BRU-1
AD7829BRU-1REEL7
AD7829BRUZ-11
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
28-Lead Thin Shrink Small Outline Package [TSSOP]
28-Lead Thin Shrink Small Outline Package [TSSOP]
28-Lead Thin Shrink Small Outline Package [TSSOP]
28-Lead Thin Shrink Small Outline Package [TSSOP]
28-Lead Standard Small Outline Package [SOIC_W]
28-Lead Standard Small Outline Package [SOIC_W]
28-Lead Standard Small Outline Package [SOIC_W]
28-Lead Standard Small Outline Package [SOIC_W]
RU-28
RU-28
RU-28
RU-28
RW-28
RW-28
RW-28
RW-28
0.75 LSB
0.75 LSB
0.75 LSB
0.75 LSB
0.75 LSB
0.75 LSB
0.75 LSB
0.75 LSB
AD7829BRUZ-1REEL71 −40°C to +85°C
AD7829BRW-1
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
AD7829BRW-1RL7
AD7829BRWZ-11
AD7829BRWZ-1RL71
1 Z = Pb-free part.
©2006 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06179-0-7/06(0)
Rev. 0 | Page 20 of 20
相关型号：
AD7829BRZ
ADC, Flash Method, 8-Bit, 1 Func, 8 Channel, Parallel, 8 Bits Access, PDSO28, LEAD FREE, MS-013AE, SOIC-28
ROCHESTER
AD7829BRZ-REEL
ADC, Flash Method, 8-Bit, 1 Func, 8 Channel, Parallel, 8 Bits Access, PDSO28, LEAD FREE, MS-013AE, SOIC-28
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AD7829BRZ-REEL7
ADC, Flash Method, 8-Bit, 1 Func, 8 Channel, Parallel, 8 Bits Access, PDSO28, LEAD FREE, MS-013AE, SOIC-28
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