AD4020BCPZ-R2 [ADI]
20-Bit, 1.8 MSPS/1 MSPS/500 kSPS, Easy Drive, Differential SAR ADCs;
| 型号： | AD4020BCPZ-R2 |
| 厂家： | 
ADI |
| 描述： | 20-Bit, 1.8 MSPS/1 MSPS/500 kSPS, Easy Drive, Differential SAR ADCs |
| 文件： | 总39页 (文件大小：1025K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
20-Bit, 1.8 MSPS/1 MSPS/500 kSPS,
Easy Drive, Differential SAR ADCs
Data Sheet
AD4020/AD4021/AD4022
FEATURES
GENERAL DESCRIPTION
Easy Drive
Greatly reduced input kickback
The AD4020/AD4021/AD4022 are high accuracy, high speed,
low power, 20-bit, Easy Drive, precision successive approximation
register (SAR) analog-to-digital converters (ADCs) that operate
Input current reduced to 0.5 μA/MSPS
Enhanced acquisition phase, ≥77% of cycle time at 1 MSPS
First conversion accurate, no latency or pipeline delay
Input span compression for single-supply operation
Fast conversion allows low SPI clock rates
Input overvoltage clamp protection sinks up to 50 mA
SPI-/QSPI-/MICROWIRE-/DSP-compatible serial interface
High performance
Differential analog input range: ±±REF, ±REF from 2.4 ± to 5.1 ±
Throughput: 1.8 MSPS/1 MSPS/500 kSPS options
INL: ±3.1 ppm maximum
Guaranteed 20-bit no missing codes
SNR: 100.5 dB at fIN = 1 kHz at ±REF 5 ±
from a single power supply, VDD. The reference voltage, VREF
,
is applied externally and can be set independent of the supply
voltage. The AD4020/AD4021/AD4022 power scales linearly
with throughput.
Easy Drive features reduce both signal chain complexity and power
consumption while enabling higher channel density. The reduced
input current, particularly in high-Z mode, coupled with a long
signal acquisition phase, eliminates the need for a dedicated
ADC driver. Easy Drive broadens the range of companion circuitry
that is capable of driving these ADCs (see Figure 2).
Input span compression eliminates the need to provide a
negative supply to the ADC driver amplifier while preserving
access to the full ADC code range. The input overvoltage clamp
protects the ADC inputs against overvoltage events, minimizing
disturbances on the reference pin, and eliminating the need for
external protection diodes.
THD: −123 dB at fIN = 1 kHz, −100 dB at fIN = 100 kHz
SINAD: 89 dB at fIN = 900 kHz (see Figure 17)
Oversampled dynamic range
104 dB for OSR = 2
131 dB for OSR = 1024
Low power
Fast device throughput up to 1.8 MSPS allows users to
accurately capture high frequency signals and to implement
oversampling techniques to alleviate the challenges associated
with antialias filter designs. Decreased serial peripheral interface
(SPI) clock rate requirements reduce digital input/output power
consumption, broadens digital host options, and simplifies the
task of sending data across digital isolation. The SPI-compatible
serial user interface is compatible with 1.8 V, 2.5 V, 3 V, and 5 V
logic by using the separate VIO logic supply.
Single 1.8 ± supply operation with 1.71 ± to 5.5 ± logic interface
2.7 mW at 500 kSPS (±DD only)
83 ꢀW at 10 kSPS, 15 mW at 1.8 MSPS (total power)
10-lead packages: 3 mm × 3 mm LFCSP, 3 mm × 4.90 mm MSOP
Pin compatible with AD4003/AD4007/AD4011 family
Guaranteed operation: −40°C to +125°C
APPLICATIONS
Automatic test equipment
Machine automation
Medical equipment
18
25°C HIGH-Z DISABLED, 1.8MSPS
25°C HIGH-Z ENABLED, 1.8MSPS
15
Battery-powered equipment
Precision data acquisition systems
Instrumentation and control systems
12
9
6
3
FUNCTIONAL BLOCK DIAGRAM
0
2.5V TO 5V 1.8V
–3
–6
–9
10µF REF
VDD
AD4020/AD4021/AD4022
VIO
SDI
1.8V TO 5V
V
REF
/2
HIGH-Z
MODE
–12
–15
TURBO
MODE
V
REF
IN+
IN–
0
SCK 3-WIRE OR
4-WIRE SPI
SDO
SERIAL
INTERFACE
20-BIT
SAR ADC
–5
–3
–1
1
3
5
INTERFACE
(DAISY
INPUT DIFFERENTIAL VOLTAGE (V)
V
REF
/2
CNV CHAIN, CS)
STATUS
BITS
SPAN
CLAMP
V
REF
COMPRESSION
Figure 2. Input Current vs. Input Differential Voltage
0
GND
Figure 1.
Rev. B
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Technical Support
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AD4020/AD4021/AD4022
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Driver Amplifier Choice ........................................................... 22
Ease of Drive Features ............................................................... 23
Voltage Reference Input ............................................................ 25
Power Supply............................................................................... 25
Digital Interface.......................................................................... 25
Register Read/Write Functionality........................................... 27
Status Bits .................................................................................... 29
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 4
Timing Specifications .................................................................. 7
Absolute Maximum Ratings............................................................ 9
Thermal Resistance ...................................................................... 9
ESD Caution.................................................................................. 9
Pin Configurations and Function Descriptions ......................... 10
Typical Performance Characteristics ........................................... 11
Terminology .................................................................................... 17
Theory of Operation ...................................................................... 18
Circuit Information.................................................................... 18
Converter Operation.................................................................. 19
Transfer Functions...................................................................... 19
Applications Information .............................................................. 20
Typical Application Diagrams .................................................. 20
Analog Inputs.............................................................................. 21
REVISION HISTORY
CS
CS
CS
CS
CS
CS
Mode, 3-Wire Turbo Mode................................................. 30
Mode, 3-Wire Without the Busy Indicator........................... 31
Mode, 3-Wire with the Busy Indicator.............................. 32
Mode, 4-Wire Turbo Mode................................................. 33
Mode, 4-Wire Without the Busy Indicator........................... 34
Mode, 4-Wire with the Busy Indicator.............................. 35
Daisy-Chain Mode..................................................................... 36
Layout Guidelines....................................................................... 37
Evaluating the AD4020/AD4021/AD4022 Performance...... 37
Outline Dimensions....................................................................... 38
Ordering Guide .......................................................................... 39
11/2019—Rev. A to Rev. B
Deleted Table 12, Table 13, and Table 14; Renumbered
Added AD4021 and AD4022............................................Universal
Added Figure 2; Renumbered Sequentially .................................. 1
Changes to Features Section and General Description Section....... 1
Changes to Specifications Section and Table 1............................. 4
Changes to Timing Specifications Section and Table 2 ............... 7
Deleted Figure 3; Renumbered Sequentially................................. 8
Changes to Table 3............................................................................ 8
Added Endnote 2, Table 5................................................................ 9
Changes to Absolute Maximum Ratings Section and Thermal
Resistance Section ............................................................................ 9
Changes to Figure 4 and Table 7................................................... 10
Changes to Typical Performance Characteristics Section......... 11
Added Figure 30 and Figure 31..................................................... 15
Changes to Terminology Section.................................................. 17
Changes to Circuit Information Section and Table 8 ................ 18
Changes to Converter Operation Section and Endnote 1 and
Endnote 2, Table 9 .......................................................................... 19
Changes to Typical Application Diagrams Section.................... 20
Changes to Input Overvoltage Clamp Circuit Section.............. 21
Changes to Figure 44, Single to Differential Driver Section, and
High Frequency Input Signals Section ........................................ 23
Changes to High-Z Mode Section, Figure 47 Caption, and
Figure 48 Caption ........................................................................... 24
Sequentially ..................................................................................... 25
Changes to Voltage Reference Input Section, Power Supply
Section, and Digital Interface Section ......................................... 25
Added Configuration Register Details Section .......................... 25
Added Serial Clock Frequency Requirements Section, Table 12,
and Table 13; Renumbered Sequentially ..................................... 26
Changes to Register Read/Write Functionality Section, Table 14,
and Figure 49................................................................................... 27
Changes to Figure 50...................................................................... 28
Changed Status Word Section to Status Bits Section................. 29
Changes to Status Bits Section and Table 15............................... 29
CS
Changes to
Caption, and Figure 54 Caption ................................................... 30
CS
Mode, 3-Wire Turbo Mode Section, Figure 54
Changes to
Section, Figure 55 Caption, and Figure 56 Caption................... 31
CS
Mode, 3-Wire Without the Busy Indicator
Changes to
Figure 57 Caption, and Figure 58 Caption.................................. 32
CS
Mode, 3-Wire with the Busy Indicator Section,
Changes to
Figure 60 Caption ........................................................................... 33
CS
Mode, 4-Wire Turbo Mode Section and
Changes to
Section and Figure 62 Caption ..................................................... 34
CS
Mode, 4-Wire Without the Busy Indicator
Changes to
Mode, 4-Wire with the Busy Indicator Section
and Figure 64 Caption ................................................................... 35
Changes to Daisy-Chain Mode Section and Figure 66 Caption ... 36
Rev. B | Page 2 of 39
Data Sheet
AD4020/AD4021/AD4022
Changes to Layout Guidelines Section and Evaluating the
AD4020/AD4021/AD4022 Performance Section.......................37
Changes to Ordering Guide...........................................................39
7/2017—Rev. 0 to Rev. A
Change to Integral Nonlinearity Error (INL) Parameter, Table 1....3
7/2017—Revision 0: Initial Version
Rev. B | Page 3 of 39
AD4020/AD4021/AD4022
SPECIFICATIONS
Data Sheet
VDD = 1.71 V to 1.89 V, VIO = 1.71 V to 5.5 V, REF pin voltage (VREF) = 5 V, all specifications TMIN to TMAX, high-Z mode disabled, span
compression disabled, turbo mode enabled, and sampling frequency (fS) = 1.8 MSPS for the AD4020, fS = 1 MSPS for the AD4021, and
fS = 500 kSPS for the AD4022, unless otherwise noted.
Table 1.
Parameter
Test Conditions/Comments
Min
Typ
Max
Unit
RESOLUTION
ANALOG INPUT
Voltage Range
20
Bits
IN+ voltage (VIN+) – IN− voltage
−VREF
+VREF
V
(VIN−
)
Span compression enabled
VIN+, VIN− to GND
Span compression enabled
−VREF × 0.8
−0.1
0.1 × VREF
VREF/2 − 0.125
+VREF × 0.8
+VREF + 0.1
0.9 × VREF
V
V
V
V
dB
nA
Operating Input Voltage
Common-Mode Input Range
Common-Mode Rejection Ratio (CMRR)
Analog Input Current
VREF/2
68
0.3
VREF/2 + 0.125
Input frequency (fIN) = 500 kHz
Acquisition phase, TA = 25°C
High-Z mode enabled, converting
dc input at 1.8 MSPS
1
µA
THROUGHPUT
Complete Cycle
AD4020
AD4021
AD4022
Conversion Time
Acquisition Phase1
AD4020
555
ns
ns
ns
ns
1000
2000
300
320
350
325
770
1770
ns
ns
ns
AD4021
AD4022
Throughput Rate2 (fS)
AD4020
AD4021
0
0
0
1.8
1
500
MSPS
MSPS
kSPS
ns
AD4022
Transient Response3
DC ACCURACY
No Missing Codes
Integral Nonlinearity Error (INL)
325
20
−3.1
−2
Bits
1
1
0.3
3.3
+3.1
+2
+0.5
ppm
ppm
LSB
LSB
LSB
ppm/°C
LSB
ppm/°C
LSB
T = 0°C to 70°C
Differential Nonlinearity Error (DNL)
Transition Noise
Zero Error
Zero Error Drift4
Gain Error
Gain Error Drift4
Power Supply Sensitivity
1/f Noise5
−0.5
−35
−0.3
−88
−1.2
+35
+0.3
+88
+1.2
12
VDD = 1.8 V 5%
Bandwidth = 0.1 Hz to 10 Hz
6
6
µV p-p
Rev. B | Page 4 of 39
Data Sheet
AD4020/AD4021/AD4022
Parameter
Test Conditions/Comments
Min
Typ
Max
Unit
AC ACCURACY
Dynamic Range
Oversampled Dynamic Range
101
104
125
131
31.5
dB
dB
dB
dB
Oversampling ratio (OSR) = 2
OSR = 256
OSR = 1024
Total RMS Noise
µV rms
fIN = 1 kHz, −0.5 dBFS, VREF = 5 V
Signal-to-Noise Ratio (SNR)
Spurious-Free Dynamic Range (SFDR)
Total Harmonic Distortion (THD)
Signal-to-Noise-and-Distortion Ratio
(SINAD)
fIN = 1 kHz, −0.5 dBFS, VREF = 2.5 V
SNR
SFDR
THD
99
100.5
122
−123
100
dB
dB
dB
dB
98.5
93.3
94.7
122
−119
94.5
dB
dB
dB
dB
SINAD
93
fIN = 100 kHz, −0.5 dBFS, VREF = 5 V
SNR
THD
SINAD
99
−100
96.5
dB
dB
dB
fIN = 400 kHz, −0.5 dBFS, VREF = 5 V
SNR
THD
SINAD
92.5
−94
90
10
1
dB
dB
dB
MHz
ns
−3 dB Input Bandwidth
Aperture Delay
Aperture Jitter
REFERENCE
1
ps rms
Voltage Range (VREF
)
2.4
5.1
V
Current
AD4020
AD4021
VREF = 5 V
1.8 MSPS
1 MSPS
1.1
0.58
0.32
mA
mA
mA
AD4022
500 kSPS
INPUT OVERVOLTAGE CLAMP
IN+/IN− Current (IIN+/IIN−
)
VREF = 5 V
VREF = 2.5 V
VREF = 5 V
VREF = 2.5 V
VREF = 5 V
VREF = 2.5 V
50
50
mA
mA
V
V
V
V
ns
µA
VIN+/VIN− at Maximum IIN+/IIN−
5.4
3.1
5.4
2.8
360
100
VIN+/VIN− Clamp On/Off Threshold
5.25
2.68
Deactivation Time
REF Current at Maximum IIN+/IIN−
DIGITAL INPUTS
VIN+/VIN− > VREF
Logic Levels
Input Voltage Low (VIL)
VIO > 2.7 V
VIO ≤ 2.7 V
VIO > 2.7 V
VIO ≤ 2.7 V
−0.3
−0.3
0.7 × VIO
0.8 × VIO
−1
+0.3 × VIO
+0.2 × VIO
VIO + 0.3
VIO + 0.3
+1
V
V
V
V
µA
µA
pF
Input Voltage High (VIH)
Input Current Low (IIL)
Input Current High (IIH)
Input Pin Capacitance
−1
+1
6
Rev. B | Page 5 of 39
AD4020/AD4021/AD4022
Data Sheet
Parameter
Test Conditions/Comments
Min
Typ
Max
Unit
DIGITAL OUTPUTS
Data Format
Serial, 20 bits, twos complement
Pipeline Delay
Conversion results available immediately
after completed conversion
Output Voltage Low (VOL
)
Output current = 500 µA
Output current = −500 µA
0.4
V
V
Output Voltage High (VOH
POWER SUPPLIES
VDD
)
VIO − 0.3
1.71
1.71
1.8
1.6
1.89
5.5
V
V
µA
VIO
Standby Current
Power Dissipation
VDD = 1.8 V, VIO = 1.8 V, TA = 25°C
VDD = 1.8 V, VIO = 1.8 V, VREF = 5 V
10 kSPS, high-Z mode disabled
500 kSPS, high-Z mode disabled
1 MSPS, high-Z mode disabled
1.8 MSPS, high-Z mode disabled
500 kSPS, high-Z mode enabled
1 MSPS, high-Z mode enabled
1.8 MSPS, high-Z mode enabled
500 kSPS, high-Z mode disabled
1 MSPS, high-Z mode disabled
1.8 MSPS, high-Z mode disabled
500 kSPS, high-Z mode disabled
1 MSPS, high-Z mode disabled
1.8 MSPS, high-Z mode disabled
500 kSPS, high-Z mode disabled
1 MSPS, high-Z mode disabled
1.8 MSPS, high-Z mode disabled
83
µW
4.5
8.3
15
5.7
10.8
19
2.7
5.1
9.0
1.6
2.9
5.0
0.13
0.4
1.0
8.3
5.1
10
19
6.9
13
25
mW
mW
mW
mW
mW
mW
mW
mW
mW
mW
mW
mW
mW
mW
mW
nJ/sample
VDD Only
REF Only
VIO Only
Energy per Conversion
TEMPERATURE RANGE
Specified Performance
TMIN to TMAX
−40
+125
°C
1 The acquisition phase is the time available for the input sampling capacitors to acquire a new input with the ADC running at a throughput rate of 1.8 MSPS for the
AD4020, 1 MSPS for the AD4021, and 500 kSPS for the AD4022.
2 A throughput rate of 1.8 MSPS can only be achieved with turbo mode enabled and a minimum serial clock (SCK) rate of 71 MHz. Refer to Table 4 for the maximum
achievable throughput for different modes of operation.
3 Transient response is the time required for the ADC to acquire a full-scale input step to 2 LSB accuracy.
4 The minimum and maximum values are guaranteed by characterization, but not production tested.
5 See the 1/f noise plot in Figure 25.
Rev. B | Page 6 of 39
Data Sheet
AD4020/AD4021/AD4022
TIMING SPECIFICATIONS
VDD = 1.71 V to 1.89 V, VIO = 1.71 V to 5.5 V, VREF = 5 V, all specifications TMIN to TMAX, high-Z mode disabled, span compression
disabled, turbo mode enabled, and fS = 1.8 MSPS for the AD4020, fS = 1 MSPS for the AD4021, and fS = 500 kSPS for the AD4022, unless
otherwise noted. See Figure 49 to Figure 52, Figure 54, Figure 56, Figure 58, Figure 60, Figure 62, Figure 64, and Figure 66 for timing
diagrams.
Table 2. Digital Interface Timing
Parameter1
Symbol
tCONV
Min
Typ
Max
Unit
CONVERSION TIME—CNV RISING EDGE TO DATA AVAILABLE
300
320
350
ns
ACQUISITION PHASE2
tACQ
AD4020
AD4021
AD4022
325
770
1770
ns
ns
ns
TIME BETWEEN CONVERSIONS
AD4020
AD4021
AD4022
CNV PULSE WIDTH (CS MODE)3
tCYC
555
1000
2000
10
ns
ns
ns
ns
tCNVH
tSCK
SCK PERIOD
CS Mode4
VIO > 2.7 V
VIO > 1.7 V
Daisy-Chain Mode5
9.8
12.3
ns
ns
VIO > 2.7 V
VIO > 1.7 V
20
25
ns
ns
SCK
Low Time
High Time
Falling Edge to Data Remains Valid Delay
Falling Edge to Data Valid Delay
tSCKL
3
3
1.5
ns
ns
ns
tSCKH
tHSDO
tDSDO
VIO > 2.7 V
VIO > 1.7 V
7.5
10.5
ns
ns
CNV OR SDI LOW TO SDO D17 MSB VALID DELAY (CS MODE)
VIO > 2.7 V
VIO > 1.7 V
tEN
10
13
ns
ns
ns
ns
ns
CNV RISING EDGE TO FIRST SCK RISING EDGE DELAY
LAST SCK FALLING EDGE TO CNV RISING EDGE DELAY6
CNV OR SDI HIGH OR LAST SCK FALLING EDGE TO SDO HIGH IMPEDANCE (CS MODE)
tQUIET1
tQUIET2
tDIS
200
60
20
SDI
Valid Setup Time from CNV Rising Edge
tSSDICNV
tHSDICNV
tSSDISCK
tHSDISCK
tHSCKCNV
2
2
ns
ns
ns
ns
ns
Valid Hold Time from CNV Rising Edge (CS Mode)
Valid Setup Time from SCK Rising Edge (Daisy-Chain Mode)
Valid Hold Time from SCK Rising Edge (Daisy-Chain Mode)
SCK VALID HOLD TIME FROM CNV RISING EDGE (DAISY-CHAIN MODE)
2
2
12
1 Timing parameters measured with respect to a falling edge are defined as triggered at X% VIO. Timing parameters measured with respect to a rising edge are defined
as triggered at Y% VIO. For VIO ≤ 2.7 V, X = 80, and Y = 20. For VIO > 2.7 V, X = 70, and Y = 30. The minimum VIH and maximum VIL are used. See Digital Inputs
Specifications in Table 1.
2 The acquisition phase is the time available for the input sampling capacitors to acquire a new input with the ADC running at a throughput rate of 1.8 MSPS for the
AD4020, 1 MSPS for the AD4021, and 500 kSPS for the AD4022.
3 For turbo mode, tCNVH must match the tQUIET1 minimum.
4 A throughput rate of 1.8 MSPS can only be achieved with turbo mode enabled and a minimum SCK rate of 71 MHz. Refer to Table 4 for the maximum achievable
throughput for different modes of operation. See the Serial Clock Frequency Requirements section for guidelines on determining the minimum SCK rate required for a
given throughput.
5 A 50% duty cycle is assumed for SCK.
6 See Figure 24 for SINAD vs. tQUIET2
.
Rev. B | Page 7 of 39
AD4020/AD4021/AD4022
Data Sheet
Table 3. Register Read/Write Timing
Parameter
Symbol1
Min
Typ
Max
Unit
READ/WRITE OPERATION
CNV Pulse Width2
SCK Period
tCNVH
tSCK
10
ns
VIO > 2.7 V
VIO > 1.7 V
SCK Low Time
SCK High Time
9.8
12.3
3
ns
ns
ns
ns
tSCKL
tSCKH
3
READ OPERATION
CNV Low to SDO D17 MSB Valid Delay
VIO > 2.7 V
VIO > 1.7 V
SCK Falling Edge to Data Remains Valid
SCK Falling Edge to Data Valid Delay
VIO > 2.7 V
tEN
10
13
ns
ns
ns
tHSDO
tDSDO
1.5
7.5
10.5
20
ns
ns
ns
VIO > 1.7 V
CNV Rising Edge to SDO High Impedance
WRITE OPERATION
tDIS
SDI Valid Setup Time from SCK Rising Edge
SDI Valid Hold Time from SCK Rising Edge
CNV Rising Edge to SCK Edge Hold Time
CNV Falling Edge to SCK Active Edge Setup Time
tSSDISCK
tHSDISCK
tHCNVSCK
tSCNVSCK
2
2
0
6
ns
ns
ns
ns
1 See Figure 49 to Figure 52, Figure 54, Figure 56, Figure 58, Figure 60, Figure 62, Figure 64, and Figure 66
2 For turbo mode, tCNVH must match the tQUIET1 minimum.
Table 4. Achievable Throughput for Different Modes of Operation
Parameter
Test Conditions/Comments
Min
Typ
Max
Unit
THROUGHPUT, CS MODE
3-Wire and 4-Wire Turbo Mode
fSCK = 100 MHz, VIO ≥ 2.7 V
fSCK = 80 MHz, VIO < 2.7 V
fSCK = 100 MHz, VIO ≥ 2.7 V
fSCK = 80 MHz, VIO < 2.7 V
fSCK = 100 MHz, VIO ≥ 2.7 V
fSCK = 80 MHz, VIO < 2.7 V
fSCK = 100 MHz, VIO ≥ 2.7 V
fSCK = 80 MHz, VIO < 2.7 V
1.80
1.80
1.80
1.67
1.61
1.49
1.47
1.34
MSPS
MSPS
MSPS
MSPS
MSPS
MSPS
MSPS
MSPS
3-Wire and 4-Wire Turbo Mode and Six Status Bits
3-Wire and 4-Wire Mode
3-Wire and 4-Wire Mode and Six Status Bits
Rev. B | Page 8 of 39
Data Sheet
AD4020/AD4021/AD4022
ABSOLUTE MAXIMUM RATINGS
Note that the input overvoltage clamp cannot sustain the
overvoltage condition for an indefinite amount of time.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Table 5.
Parameter
Rating
θJA is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure.
Analog Inputs
IN+, IN− to GND1
−0.3 V to VREF + 0.4 V,
or 50 mA2
θJC is the junction to case thermal resistance.
Supply Voltage
REF, VIO to GND
VDD to GND
VDD to VIO
Digital Inputs to GND
Digital Output to GND
Storage Temperature Range
Junction Temperature
Lead Temperature Soldering Reflow
−0.3 V to +6.0 V
−0.3 V to +2.1 V
−6 V to +2.4 V
−0.3 V to VIO + 0.3 V
−0.3 V to VIO + 0.3 V
−65°C to +150°C
150°C
Table 6. Thermal Resistance
Package Type1
RM-10
θJA
θJC
38
33
Unit
°C/W
°C/W
147
114
CP-10-9
1 Test Condition 1: thermal impedance simulated values are based upon use
of 2S2P JEDEC PCB. See the Ordering Guide section.
260°C as per (JEDEC J-
STD-020)
ESD CAUTION
ESD Ratings
Human Body Model
Machine Model
4 kV
200 V
Field Induced Charged Device Model 1.25 kV
1 See the Analog Inputs section for an explanation of IN+ and IN−.
2 Current condition tested over a 10 ms interval.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. B | Page 9 of 39
AD4020/AD4021/AD4022
Data Sheet
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
REF 1
VDD 2
IN+ 3
10 VIO
AD4020/
AD4021/
AD4022
9
8
7
6
SDI
SCK
SDO
CNV
TOP VIEW
IN– 4
(Not to Scale)
REF
VDD
IN+
1
2
3
4
5
10 VIO
GND 5
AD4020/
AD4021/
AD4022
9
8
7
6
SDI
SCK
SDO
CNV
NOTES
1. EXPOSED PAD. CONNECT THE EXPOSED
PAD TO GND. THIS CONNECTION IS NOT
REQUIRED TO MEET THE SPECIFIED
PERFORMANCE.
IN–
TOP VIEW
(Not to Scale)
GND
Figure 3. 10-Lead MSOP Pin Configuration
Figure 4. 10-Lead LFCSP Pin Configuration
Table 7. Pin Function Descriptions
Pin No. Mnemonic Type1 Description
1
REF
AI
Reference Input Voltage. The VREF range is 2.4 V to 5.1 V. This pin is referred to the GND pin and must be
decoupled closely to the GND pin with a 10 μF X7R ceramic capacitor.
2
3
4
5
6
VDD
IN+
IN−
GND
CNV
P
1.8 V Power Supply. The VDD range is 1.71 V to 1.89 V. Bypass VDD to GND with a 0.1 ꢀF ceramic capacitor.
Differential Positive Analog Input. See the Differential Input Considerations section.
Differential Negative Analog Input. See the Differential Input Considerations section.
Power Supply Ground. Connect to the ground plane of the board.
Convert Input. This input has multiple functions. On the leading edge, the input initiates the conversions
and selects the interface mode of the device, which is either daisy-chain mode or CS mode. In CS mode,
the SDO pin is enabled when CNV is low. In daisy-chain mode, the data is read when CNV is high.
AI
AI
P
DI
7
SDO
DO
Serial Data Output. The conversion result is output on this pin. The pin is synchronized to the SCK signal
on the SCK pin.
8
9
SCK
SDI
DI
DI
Serial Data Clock Input. When the device is selected, the conversion result is shifted out by this clock.
Serial Data Input. This input provides multiple features and selects the interface mode of the ADC as
follows.
Daisy-chain mode is selected if SDI is low during the CNV rising edge. In this mode, SDI is used as a data
input to daisy-chain the conversion results of two or more ADCs onto a single SDO line. The digital data
level on SDI is output on SDO with a delay of 20 SCK cycles.
CS mode is selected if SDI is high during the CNV rising edge. In this mode, either SDI or CNV can enable
the serial output signals when low. If SDI or CNV is low when the conversion is complete, the busy indicator
feature is enabled. With CNV low, program the device by clocking in a 16-bit word on SDI on the rising
edge of SCK.
10
VIO
P
P
Input/Output Interface Digital Power. Nominally, this pin is at the same supply as the host interface (1.8 V,
2.5 V, 3 V, or 5 V). Bypass VIO to ground with a 0.1 ꢀF ceramic capacitor.
Exposed Pad. Connect the exposed pad to GND. This connection is not required to meet the specified
performance. Note that the exposed pad only applies to the LFCSP.
N/A2
EPAD
1 AI is analog input, P is power, DI is digital input, and DO is digital output.
2 N/A means not applicable.
Rev. B | Page 10 of 39
Data Sheet
AD4020/AD4021/AD4022
TYPICAL PERFORMANCE CHARACTERISTICS
VDD = 1.8 V, VIO = 3.3 V, VREF = 5 V, T = 25°C, high-Z mode disabled, span compression disabled, turbo mode enabled, and fS = 1.8 MSPS for
the AD4020, fS = 1 MSPS for the AD4021, and fS = 500 kSPS for the AD4022, unless otherwise noted.
2.0
1.0
+125°C
+25°C
–40°C
+125°C
+25°C
–40°C
0.8
1.5
0.6
1.0
0.4
0.5
0.2
0
0
–0.2
–0.4
–0.6
–0.8
–1.0
–0.5
–1.0
–1.5
–2.0
0
131072 262144 393216 524288 655360 786432 917504 1048576
CODE
0
131072 262144 393216 524288 655360 786432 917504 1048576
CODE
Figure 8. DNL vs. Code for Various Temperatures, VREF = 5 V
Figure 5. INL vs. Code for Various Temperatures, VREF = 5 V
1.0
2.0
1.5
+125°C
+25°C
–40°C
+125°C
+25°C
–40°C
0.8
0.6
1.0
0.4
0.5
0.2
0
0
–0.2
–0.4
–0.6
–0.8
–1.0
–0.5
–1.0
–1.5
–2.0
0
131072 262144 393216 524288 655360 786432 917504 1048576
CODE
0
131072 262144 393216 524288 655360 786432 917504 1048576
CODE
Figure 6. INL vs. Code for Various Temperatures, VREF = 2.5 V
Figure 9. DNL vs. Code for Various Temperatures, VREF = 2.5 V
1.0
3
2
HIGH-Z ENABLED
SPAN COMPRESSION ENABLED
HIGH-Z ENABLED
SPAN COMPRESSION ENABLED
0.8
0.6
0.4
1
0.2
0
0
–0.2
–0.4
–0.6
–0.8
–1.0
–1
–2
–3
0
131072 262144 393216 524288 655360 786432 917504 1048576
CODE
0
131072 262144 393216 524288 655360 786432 917504 1048576
CODE
Figure 10. DNL vs. Code for High-Z and
Span Compression Modes Enabled, VREF = 5V
Figure 7. INL vs. Code for High-Z and
Span Compression Modes Enabled, VREF = 5 V
Rev. B | Page 11 of 39
AD4020/AD4021/AD4022
Data Sheet
250000
250000
200000
150000
100000
50000
0
2.5V CODE CENTER
5V CODE CENTER
2.5V CODE TRANSITION
5V CODE TRANSITION
200000
150000
100000
50000
0
524210
524220
524230
524240
524250
524260
524270
524205
524215
524225
524235
524245
524255
524265
ADC CODE
ADC CODE
Figure 11. Histogram of a DC Input at Code Center, VREF = 2.5 V and VREF = 5 V
Figure 14. Histogram of a DC Input at Code Transition, VREF = 2.5 V and VREF = 5 V
0
0
V
= 2.5V
REF
V
= 5V
REF
–20
–40
–20
–40
SNR = 95.01dB
THD = –118.60dB
SINAD = 94.99dB
SNR = 100.33dB
THD = –123.99dB
SINAD = 100.31dB
–60
–60
–80
–80
–100
–120
–140
–160
–180
–100
–120
–140
–160
–180
100
1k
10k
100k
900k
100
1k
10k
100k
900k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 12. 1 kHz, −0.5 dBFS Input Tone Fast Fourier Transform (FFT),
REF = 5 V
Figure 15. 1 kHz, −0.5 dBFS Input Tone FFT, VREF = 2.5 V
V
0
–20
0
–20
V
= 5V
REF
V
= 5V
REF
SNR = 91.22dB
THD = –91.97dB
SINAD = 89.15dB
SNR = 98.37dB
THD = –98.52dB
SINAD = 95.58dB
–40
–40
–60
–60
–80
–80
–100
–120
–140
–160
–180
–100
–120
–140
–160
–180
1k
10k
FREQUENCY (Hz)
100k
900k
1k
10k
FREQUENCY (Hz)
100k
900k
Figure 13. 100 kHz, −0.5 dBFS Input Tone FFT
Figure 16. 400 kHz, −0.5 dBFS Input Tone FFT
Rev. B | Page 12 of 39
Data Sheet
AD4020/AD4021/AD4022
102
100
98
17.0
16.5
16.0
15.5
15.0
14.5
14.0
–90
–95
120
115
110
105
100
95
–100
–105
–110
–115
–120
96
94
92
ENOB
SINAD
SNR
90
THD
SFDR
88
1k
90
900k
10k
100k
900k
1k
10k
100k
INPUT FREQUENCY (Hz)
INPUT FREQUENCY (Hz)
Figure 17. SNR, SINAD, and Effective Number of Bits (ENOB) vs. Input
Frequency
Figure 20. THD and SFDR vs. Input Frequency
102
101
100
99
16.6
16.4
16.2
16.0
15.8
15.6
15.4
–114
–116
–118
–120
–122
–124
–126
–128
–130
133
132
131
130
129
128
127
126
98
97
96
SFDR
THD
ENOB
SINAD
SNR
95
94
2.4
2.4
2.7
3.0
3.3
3.6
3.9
4.2
4.5
4.8
5.1
2.7
3.0
3.3
3.6
3.9
4.2
4.5
4.8
5.1
REFERENCE VOLTAGE (V)
REFERENCE VOLTAGE (V)
Figure 18. SNR, SINAD, and ENOB vs. Reference Voltage, fIN = 1 kHz
Figure 21. THD and SFDR vs. Reference Voltage, fIN = 1 kHz
100.8
100.6
100.4
100.2
100.0
99.8
16.42
16.40
16.38
16.36
16.34
16.32
16.30
16.28
16.26
16.24
16.22
–114.0
–114.5
–115.0
–115.5
–116.0
–116.5
–117.0
–117.5
118.0
117.9
117.8
117.7
117.6
117.5
117.4
117.3
117.2
117.1
117.0
THD
ENOB
SINAD
SNR
SFDR
99.6
99.4
–40
–20
0
20
40
60
80
100
120
–40
–20
0
20
40
60
80
100
120
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 19. SNR, SINAD, and ENOB vs. Temperature, fIN = 1 kHz
Figure 22. THD and SFDR vs. Temperature, fIN = 1 kHz
Rev. B | Page 13 of 39
AD4020/AD4021/AD4022
Data Sheet
140
–85
–90
DYNAMIC RANGE
fIN = 1kHz
fIN = 10kHz
135
130
125
120
115
110
105
100
95
–95
–100
–105
–110
–115
–120
–125
1kΩ HIGH-Z DISABLED
1kΩ HIGH-Z ENABLED
510Ω HIGH-Z DISABLED
510Ω HIGH-Z ENABLED
150Ω HIGH-Z DISABLED
150Ω HIGH-Z ENABLED
1
10
20
0
2
4
8
16
32
64 128 256 512 1024
INPUT FREQUENCY (KHz)
DECIMATION RATE
Figure 26. THD vs. Input Frequency for Various Source Impedances
Figure 23. SNR vs. Decimation Rate for Various Input Frequencies, 1.8 MSPS
101
100
99
10
ZERO ERROR
PFS GAIN ERROR
NFS GAIN ERROR
8
6
4
98
2
97
0
96
–2
–4
–6
95
94
93
VIO = 5.5V
VIO = 3.6V
VIO = 1.89V
0
10
20
30
40
50
60
70
80
–40
–20
0
20
40
60
80
100
120
TEMPERATURE (°C)
tQUIET2 (ns)
Figure 24. SINAD vs. tQUIET2
Figure 27. Zero Error and Gain Error vs. Temperature (PFS Is Positive Full
Scale and NFS Is Negative Full Scale)
18
60
59
58
57
56
55
54
25°C HIGH-Z DISABLED, 1.8MSPS
25°C HIGH-Z DISABLED, 1MSPS
25°C HIGH-Z DISABLED, 500MSPS
25°C HIGH-Z ENABLED, 1.8MSPS
25°C HIGH-Z ENABLED, 1MSPS
25°C HIGH-Z ENABLED, 500MSPS
15
12
9
6
3
0
–3
–6
–9
–12
–15
0
1
2
3
4
5
6
7
8
9
10
–5
–3
–1
1
3
5
INPUT DIFFERENTIAL VOLTAGE (V)
TIME (Seconds)
Figure 25. 1/f Noise for 0.1 Hz to 10 Hz Bandwidth, 50 kSPS, 2500 Samples
Averaged per Reading
Figure 28. Analog Input Current vs. Input Differential Voltage
Rev. B | Page 14 of 39
Data Sheet
AD4020/AD4021/AD4022
10
9
8
7
6
5
4
3
2
1
0
72
71
70
69
68
67
66
VDD HIGH-Z DISABLED
VDD HIGH-Z ENABLED
REF HIGH-Z DISABLED
REF HIGH-Z ENABLED
VIO HIGH-Z DISABLED
VIO HIGH-Z ENABLED
–40
–20
0
20
40
60
80
100
120
100
1k
10k
100k
1M
TEMPERATURE (°C)
FREQUENCY (Hz)
Figure 29. Operating Current vs. Temperature, AD4020, 1.8 MSPS
Figure 32. Common-Mode Rejection Ratio (CMRR) vs. Frequency
5.0
4.5
80
75
70
65
60
55
50
4.0
3.5
3.0
VDD HIGH-Z DISABLED
VDD HIGH-Z ENABLED
REF HIGH-Z DISABLED
REF HIGH-Z ENABLED
VIO HIGH-Z DISABLED
VIO HIGH-Z ENABLED
2.5
2.0
1.5
1.0
0.5
0
100
1k
10k
100k
1M
–40
10
60
110
TEMPERATURE (°C)
FREQUENCY (Hz)
Figure 30. Operating Current vs. Temperature, AD4021, 1 MSPS
Figure 33. PSRR vs. Frequency
1.0
0.9
0.8
0.7
0.6
2.5
1.8MSPS
1MSPS
500kSPS
2.0
1.5
VDD HIGH-Z DISABLED
VDD HIGH-Z ENABLED
REF HIGH-Z DISABLED
REF HIGH-Z ENABLED
VIO HIGH-Z DISABLED
VIO HIGH-Z EVABLED
0.5
0.4
1.0
0.5
0
0.3
0.2
0.1
0
2.4
2.7
3.0
3.3
3.6
3.9
4.2
4.5
4.8
5.1
–40
10
60
110
REFERENCE VOLTAGE (V)
TEMPERATURE (°C)
Figure 34. Reference Current vs. Reference Voltage
Figure 31. Operating Current vs. Temperature, AD4022, 500 kSPS
Rev. B | Page 15 of 39
AD4020/AD4021/AD4022
Data Sheet
100k
VDD
VIO
23
21
19
17
15
13
11
9
V
VIO = 5V
VIO = 3.3V
VIO = 1.8V
REF
10k
TOTAL POWER
1k
100
10
1
0.10
0.01
7
5
0
20
40
60
80 100 120 140 160 180 200 220
LOAD CAPACITANCE (pF)
10
100
1k
10k
100k
1M 1.8M
THROUGHPUT (SPS)
Figure 35. Power Dissipation vs. Throughput, VIO = 1.8 V, VREF = 5 V
Figure 37 . tDSDO vs. Load Capacitance
25.0
22.5
20.0
17.5
15.0
12.5
10.0
7.5
5.0
2.5
0
–40
–20
0
20
40
60
80
100
120
TEMPERATURE (°C)
Figure 36. Standby Current vs. Temperature
Rev. B | Page 16 of 39
Data Sheet
AD4020/AD4021/AD4022
TERMINOLOGY
Integral Nonlinearity Error (INL)
Dynamic Range
INL is the deviation of each individual code from a line drawn
from negative full scale through positive full scale. The point
used as negative full scale occurs ½ LSB before the first code
transition. Positive full scale is defined as a level 1½ LSB beyond
the last code transition. The deviation is measured from the
middle of each code to the true straight line (see Figure 39).
Dynamic range is the ratio of the rms value of the full scale to
the total rms noise measured. The value for dynamic range is
expressed in decibels. It is measured with a signal at −60 dBFS
so that it includes all noise sources and DNL artifacts.
Signal-to-Noise Ratio (SNR)
SNR is the ratio of the rms value of the actual input signal to the
rms sum of all other spectral components below the Nyquist
frequency, excluding harmonics and dc. The value for SNR is
expressed in decibels.
Differential Nonlinearity Error (DNL)
In an ideal ADC, code transitions are 1 LSB apart. DNL is the
maximum deviation from this ideal value. It is often specified in
terms of resolution for which no missing codes are guaranteed.
Signal-to-Noise-and-Distortion Ratio (SINAD)
Zero Error
SINAD is the ratio of the rms value of the actual input signal to
the rms sum of all other spectral components that are less than
the Nyquist frequency, including harmonics but excluding dc.
The value of SINAD is expressed in decibels.
Zero error is the difference between the ideal voltage that
results in the first code transition (½ LSB above analog ground)
and the actual voltage producing that code.
Gain Error
Aperture Delay
The first transition (from 100 … 00 to 100 … 01) occurs at a
level ½ LSB above nominal negative full scale (−4.999995 V for
the 5 V range). The last transition (from 011 … 10 to 011 …
11) occurs for an analog voltage 1½ LSB below the nominal full
scale (+4.999986 V for the 5 V range). The gain error is the
deviation of the difference between the actual level of the last
transition and the actual level of the first transition from the
difference between the ideal levels.
Aperture delay is the measure of the acquisition performance
and is the time between the rising edge of the CNV input and
when the input signal is held for a conversion.
Transient Response
Transient response is the time required for the ADC to acquire
a full-scale input step to 1 LSB accuracy.
Common-Mode Rejection Ratio (CMRR)
CMRR is the ratio of the power in the ADC output at the
frequency, f, to the power of a 200 mV p-p sine wave applied to
the common-mode voltage of IN+ and IN− of frequency, f.
Spurious-Free Dynamic Range (SFDR)
SFDR is the difference, in decibels (dB), between the rms
amplitude of the input signal and the peak spurious signal.
CMRR (dB) = 10log(P
ADC_IN/PADC_OUT
)
Effective Number of Bits (ENOB)
ENOB is a measurement of the resolution with a sine wave
input. It is related to SINAD as follows:
where:
ADC_IN is the common-mode power at the frequency, f, applied
to the IN+ and IN− inputs.
ADC_OUT is the power at the frequency, f, in the ADC output.
P
ENOB = (SINAD − 1.76)/6.02
P
ENOB is expressed in bits and SINAD is expressed in dB..
Power Supply Rejection Ratio (PSRR)
Total Harmonic Distortion (THD)
PSRR is the ratio of the power in the ADC output at the
frequency, f, to the power of a 200 mV p-p sine wave applied to
the ADC VDD supply of frequency, f.
THD is the ratio of the rms sum of the first five harmonic
components to the rms value of a full-scale input signal and is
expressed in decibels.
PSRR (dB) = 10 log(PVDD_IN/PADC_OUT
where:
)
P
VDD_IN is the power at the frequency, f, at the VDD pin.
P
ADC_OUT is the power at the frequency, f, in the ADC output.
Rev. B | Page 17 of 39
AD4020/AD4021/AD4022
Data Sheet
THEORY OF OPERATION
IN+
SWITCHES CONTROL
CONTROL
SW+
MSB
LSB
524,288C 262,144C
4C
4C
2C
2C
C
C
C
C
BUSY
REF
COMP
LOGIC
GND
524,288C 262,144C
MSB
OUTPUT CODE
LSB SW–
CNV
IN–
Figure 38. ADC Simplified Schematic
range up to 100 kHz. For frequencies greater than 100 kHz and
multiplexing functionality, disable high-Z mode.
CIRCUIT INFORMATION
The AD4020/AD4021/AD4022 are high speed, low power,
single-supply, precise, 20-bit differential ADCs based on a SAR
architecture.
For single-supply applications, a span compression feature
creates additional headroom and footroom for the driving
amplifier to access the full range of the ADC.
The AD4020 is capable of converting 1,800,000 samples per
second (1.8 MSPS), the AD4021 is capable of converting
1,000,000 samples per second (1 MSPS), and the AD4022 is
capable of converting 500,000 samples per second (500 kSPS).
The power consumption of the AD4020/AD4021/AD4022
scales with throughput because they power down in between
conversions. For example, when operating at 10 kSPS, they
typically consume 83 µW, making them ideal for battery-
powered applications. The AD4020/AD4021/AD4022 also have a
valid first conversion after being powered down for long periods,
which can further reduce power consumed in applications in
which the ADC does not need to be constantly converting.
The fast conversion time of the AD4020/AD4021/AD4022, along
with turbo mode, allows low clock rates to read back conversions
even when running at their respective maximum throughput
rates. Note that, for the AD4020, the full throughput rate of
1.8 MSPS can be achieved only with turbo mode enabled.
The AD4020/AD4021/AD4022 can interface with any 1.8 V to
5 V digital logic family. These devices are available in a 10-lead
MSOP or a tiny 10-lead LFCSP that allows space savings and
flexible configurations.
The AD4020/AD4021/AD4022 are pin for pin compatible with
some of the 14-/16-/18-/20-bit precision SAR ADCs listed in
Table 8.
The AD4020/AD4021/AD4022 provide the user with an on-chip
track-and-hold and do not exhibit any pipeline delay or latency,
making them ideal for multiplexed applications.
Table 8. MSOP and LFCSP 14-/16-/18-/20-Bit Precision SAR
ADCs
The AD4020/AD4021/AD4022 incorporate a multitude of
unique, easy to use features that result in a lower system power
and smaller footprint.
400 kSPS to
500 kSPS
Not applicable Not applicable AD40222
Bits 100 kSPS
201
250 kSPS
≥1000 kSPS
AD40202
AD40212
The AD4020/AD4021/AD4022 each have an internal voltage
clamp that protects the device from overvoltage damage on the
analog inputs.
181
AD7989-12
AD7684
AD76912
AD7687
AD7690,2
AD7989-5,2
AD40112
AD4003,2
AD4007,2
AD7982,2
AD79842
AD4001,2
AD4005,2
AD79152
AD4000,2
AD4004,2
AD7980,2
AD79832
The analog input incorporates circuitry that reduces the nonlinear
charge kickback seen from a typical switched capacitor SAR input.
This reduction in kickback, combined with a longer acquisition
phase, allows the use of lower bandwidth and lower power
amplifiers as drivers. This combination has the additional benefit of
allowing a larger resistor value in the input RC filter and a
corresponding smaller capacitor, which results in a smaller RC load
for the amplifier, improving stability and power dissipation.
161
163
AD7688,2
AD76932
AD7680,
AD7683,
AD7988-12
AD7685,2
AD76942
AD7686,2
AD7988-52
143
AD7940
AD79422
AD79462
Not applicable
1 True differential.
2 Pin for pin compatible.
3 Pseudo differential.
High-Z mode can be enabled via the SPI interface by programming
a register bit (see Table 12). When high-Z mode is enabled, the
ADC input has a low input charging current at low input signal
frequencies as well as improved distortion over a wide frequency
Rev. B | Page 18 of 39
Data Sheet
AD4020/AD4021/AD4022
CONVERTER OPERATION
TRANSFER FUNCTIONS
The AD4020/AD4021/AD4022 are SAR-based ADCs using a
charge redistribution sampling digital-to-analog converter
(DAC). Figure 38 shows the simplified schematic of the ADC. The
capacitive DAC consists of two identical arrays of 20 binary
weighted capacitors that are connected to the comparator inputs.
The ideal transfer characteristics for the AD4020/AD4021/
AD4022 are shown in Figure 39 and Table 9.
011...111
011...110
011...101
During the acquisition phase, terminals of the array tied to the
input of the comparator are connected to the GND pin via the
SW+ and SW− switches (see Figure 38). All independent
switches connect the other terminal of each capacitor to the
analog inputs. The capacitor arrays are used as sampling
capacitors and acquire the analog signal on the IN+ and IN−
inputs.
100...010
100...001
100...000
–FSR
When the acquisition phase is complete and the CNV input
goes high, a conversion phase initiates. When the conversion
phase begins, SW+ and SW− are opened first. The two capacitor
arrays are then disconnected from the inputs and connected to
the GND input. The differential voltage between the IN+ and IN−
inputs captured at the end of the acquisition phase is applied to the
comparator inputs, unbalancing the comparator. By switching
each element of the capacitor array between the GND pin and
–FSR + 1 LSB
+FSR – 1 LSB
–FSR + 0.5 LSB
+FSR – 1.5 LSB
ANALOG INPUT
Figure 39. ADC Ideal Transfer Function (FSR Is Full-Scale Range)
V
REF, the comparator input varies by binary weighted voltage
steps (VREF/2, VREF/4, …, VREF/1,048,576). The control logic toggles
these switches, starting with the MSB, to bring the comparator
back into a balanced condition. After the process completes, the
control logic generates the ADC output code and a busy signal
indicator.
Because the AD4020/AD4021/AD4022 have on-board conversion
clocks, the serial clock, SCK, is not required for the conversion
process.
Table 9. Output Codes and Ideal Input Voltages
Description
FSR − 1 LSB
Midscale + 1 LSB
Midscale
Analog Input, VREF = 5 V
+4.99999046 V
+9.54 µV
VREF = 5 V with Span Compression Enabled
Digital Output Code (Hex)
0x7FFFF1
0x00001
+3.99999237 V
+7.63 µV
0 V
0 V
0x00000
Midscale − 1 LSB
−FSR + 1 LSB
−FSR
−9.54 µV
−4.99999046 V
−5 V
−7.63 µV
−3.99999237 V
−4 V
0xFFFFF
0x80001
0x800002
1 This output code is also the code for an overranged analog input (VIN+ − VIN− above VREF with span compression disabled and above 0.8 × VREF with span compression
enabled).
2 This output code is also the code for an underranged analog input (VIN+ − VIN− below −VREF with span compression disabled and below -0.8 × VREF with span compression
enabled).
Rev. B | Page 19 of 39
AD4020/AD4021/AD4022
Data Sheet
APPLICATIONS INFORMATION
Figure 41 shows a recommended connection diagram when
TYPICAL APPLICATION DIAGRAMS
using a single-supply system. This setup is preferable when only
a limited number of rails are available in the system and power
dissipation is of critical importance.
Figure 40 shows an example of the recommended connection
diagram for the AD4020/AD4021/AD4022 when multiple
supplies, V+ and V−, are available. This configuration is used for
optimal performance because the amplifier supplies can be
selected to allow the maximum signal range (see Figure 40 for
the range).
Figure 42 shows a typical application diagram when using a
fully differential amplifier.
V+ ≥ +6.5V
REF
LDO
1.8V
AMP
V
/2
REF
5V
0.1µF
10kΩ
10µF
0.1µF 1.8V TO 5V
HOST
SUPPLY
10kΩ
V+
R
AMP
V
REF
V
/2
REF
VDD
VIO
SDI
REF
C
0V
IN+
IN–
V–
V+
AD4020/
AD4021/
AD4022
SCK
SDO
CNV
DIGITAL HOST
(MICROPROCESSOR/
FPGA)
R
GND
AMP
V
REF
V
/2
3-WIRE/4-WIRE
INTERFACE
REF
C
0V
V–
V– ≤ –0.5V
Figure 40. Typical Application Diagram with Multiple Supplies
V+ = +5V
1
REF
LDO
AMP
V
/2
REF
4.096V
2
1.8V
0.1µF 1.8V TO 5V
10kΩ
0.1µF
HOST
SUPPLY
10µF
10kΩ
100nF
100nF
R
AMP
V
REF
V
/2
REF
REF
VDD VIO
C
0
SDI
IN+
IN–
AD4020/
AD4021/
AD40222
SCK
DIGITAL HOST
(MICROPROCESSOR/
FPGA)
SDO
CNV
R
GND
AMP
V
REF
3-WIRE/4-WIRE
INTERFACE
V
/2
REF
C
0
3, 4
1
2
3
4
SEE THE VOLTAGE REFERENCE INPUT SECTION FOR REFERENCE SELECTION.
IS USUALLY A 10µF CERAMIC CAPACITOR (X7R).
SEE THE DRIVER AMPLIFIER CHOICE SECTION.
SEE THE ANALOG INPUTS SECTION.
C
REF
Figure 41. Typical Application Diagram with a Single Supply
Rev. B | Page 20 of 39
Data Sheet
AD4020/AD4021/AD4022
V+ = +5V
REF
LDO
AMP
4.096V
V
/2
REF
1.8V
R4
1kΩ
R3
1kΩ
V
1.8V TO 5V
0.1µF
0.1µF
HOST
SUPPLY
REF
10kΩ
10µF
V
/2
REF
10kΩ
0
V+
+IN
–IN
REF
VDD
VIO
R
–OUT
SDI
IN+
IN–
C
C
AD4020/
AD4021/
AD4022
SCK
SDO
CNV
DIGITAL HOST
(MICROPROCESSOR/
FPGA)
V
/2
REF
V
OCM
+OUT
0.1µF
R
DIFFERENTIAL
AMPLIFIER
GND
3-WIRE/4-WIRE
INTERFACE
V–
R1
1kΩ
V
REF
V
/2
REF
0
R2
1kΩ
Figure 42. Typical Application Diagram with a Fully Differential Amplifier
the clamp into ground, preventing the input from rising further
and potentially causing damage to the device. The clamp turns
on before D1 (see Figure 43) and can sink up to 50 mA of current.
ANALOG INPUTS
Figure 43 shows an equivalent circuit of the analog input
structure, including the overvoltage clamp of the
AD4020/AD4021/AD4022.
OV
When the clamp is active, it sets the overvoltage ( ) clamp
REF
flag bit in the configuration register that is accessed with a
OV
16-bit SPI read command or via the
OV
in the status bits. The
D1
C
clamp flag gives an indication of overvoltage condition
IN
R
R
IN
IN+/IN–
EXT
0V TO 15V
OV
when it is set to 0. The
clamp flag is a read only sticky bit,
and is cleared only if the register is read while the overvoltage
condition is no longer present.
C
C
D2
V
CLAMP
EXT
PIN
IN
The clamp circuit does not dissipate static power in the off state.
Note that the clamp cannot sustain the overvoltage condition
for an indefinite amount of time.
GND
Figure 43. Equivalent Analog Input Circuit
Input Overvoltage Clamp Circuit
The external RC filter, formed by Resistor REXT and Capacitor CEXT
(see Figure 43), is usually present at the ADC input to band limit
the input signal. During an overvoltage event, excessive voltage
is dropped across REXT, and REXT becomes part of a protection
circuit. The REXT value can vary from 200 Ω to 20 kΩ for 15 V
protection. The CEXT value can be as low as 100 pF for correct
operation of the clamp. See Table 1 for input overvoltage clamp
specifications.
Most ADC analog inputs, IN+ and IN−, have no overvoltage
protection circuitry apart from ESD protection diodes. During
an overvoltage event, an ESD protection diode from an analog
input pin (IN+ or IN−) to REF forward biases and shorts the
input pin to REF, potentially overloading the reference or
damaging the device. The AD4020/AD4021/AD4022 internal
overvoltage clamp circuit with a larger external resistor (REXT
200 Ω) eliminates the need for external protection diodes and
protects the ADC inputs against dc overvoltages.
=
Differential Input Considerations
The analog input structure allows the sampling of the true
differential signal between IN+ and IN−. By using these differential
inputs, signals common to both inputs are rejected. Figure 32
shows the common-mode rejection capability of the AD4020/
AD4021/AD4022 over frequency. It is important to note that the
differential input signals must be truly antiphase in nature, 180° out
of phase, which is required to keep the common-mode voltage of
the input signal within the specified range around VREF/2, as
shown in Table 1.
In applications where the amplifier rails are greater than VREF
and less than ground, it is possible for the output to exceed the
input voltage range (specified in Table 1) of the device. In this
case, the AD4020/AD4021/AD4022 internal voltage clamp
circuit ensures that the voltage on the input pin does not exceed
V
REF + 0.4 V and prevents damage to the device by clamping the
input voltage in a safe operating range and avoiding disturbance of
the reference, which is particularly important for systems that
share the reference among multiple ADCs.
If the analog input exceeds the reference voltage by 0.4 V, the
internal clamp circuit turns on and the current flows through
Rev. B | Page 21 of 39
AD4020/AD4021/AD4022
Data Sheet
Switched Capacitor Input
DRIVER AMPLIFIER CHOICE
During the acquisition phase, the impedance of the analog
inputs (IN+ or IN−) can be modeled as a parallel combination
of Capacitor CPIN and the network formed by the series connection
of RIN and CIN. CPIN is primarily the pin capacitance. RIN is typically
400 Ω and is a lumped component composed of serial resistors
and the on resistance of the switches. CIN is typically 40 pF and
is mainly the ADC sampling capacitor.
Although the AD4020/AD4021/AD4022 are easy to drive, the
driver amplifier must meet the following requirements:
•
The noise generated by the driver amplifier must be kept
low enough to preserve the SNR and transition noise
performance of the AD4020/AD4021/AD4022. The noise
from the driver is filtered by the single-pole, low-pass filter
of the analog input circuit made by RIN and CIN, or by the
external filter, if one is used. Because the typical noise of
the AD4020/AD4021/AD4022 is 31.5 µV rms, the SNR
degradation due to the amplifier is the following:
During the conversion phase, where the switches are open, the
input impedance is limited to CPIN. RIN and CIN make a single-
pole, low-pass filter that reduces undesirable aliasing effects and
limits noise.
RC Filter Values
31.5
SNRLOSS = 20 log
The RC filter value (represented by R and C in Figure 40 to
Figure 42 and Figure 44) and driving amplifier can be selected
depending on the input signal bandwidth of interest at the full
throughput. Lower input signal bandwidth means that the RC
cutoff can be lower, thereby reducing noise into the converter.
For optimum performance at various throughputs, use the
recommended RC values (200 Ω, 180 pF) and the ADA4807-1.
π
31.52 + f−3dB (NeN )2
2
where:
f−3 dB is the input bandwidth, in megahertz, of the AD4020/
AD4021/AD4022 (10 MHz) or the cutoff frequency of the
input filter, if one is used.
N is the noise gain of the amplifier (for example, 1 in buffer
configuration).
eN is the equivalent input noise voltage of the operational
amplifier in nV/√Hz.
The RC values in Table 10 are chosen for ease of drive considera-
tions and greater ADC input protection. The combination of a
large R value (200 Ω) and small C value results in a reduced
dynamic load for the amplifier to drive. The smaller value of C
means fewer stability and phase margin concerns with the
amplifier. The large value of R limits the current into the ADC
input when the amplifier output exceeds the ADC input range.
•
•
For ac applications, the driver must have a THD performance
commensurate with the AD4020/AD4021/AD4022.
For multichannel multiplexed applications, the driver
amplifier and the analog input circuit of the AD4020/
AD4021/AD4022 must settle for a full-scale step onto the
capacitor array at a 20-bit level (0.00001%, 1 ppm). In the
amplifier data sheets, settling at 0.1% to 0.01% is more
commonly specified. Settling at 0.1% to 0.01% can differ
significantly from the settling time at a 20-bit level and
must be verified prior to driver selection.
Table 10. RC Filter and Amplifier Selection for Various Input Bandwidths
Input Signal
Bandwidth (kHz)
Recommended
Amplifier
See the High-Z Mode See the High-Z Mode See the High-Z Mode
Recommended Fully Differential
Amplifier
R (Ω)
C (pF)
<10
ADA4940-1
section
section
section
<200
>200
Multiplexed
200
200
200
180
120
120
ADA4807-1
ADA4897-1
ADA4897-1
ADA4940-1
ADA4932-1
ADA4932-1
Rev. B | Page 22 of 39
Data Sheet
AD4020/AD4021/AD4022
V+ = +5V
REF
LDO
AMP
4.096V
V
/2
1.8V
0.1µF 0.1µF
REF
R4
1kΩ
R3
1kΩ
1.8V TO 5V
V
HOST
SUPPLY
REF
10kΩ
10µF
V
/2
REF
0
10kΩ
V+
+IN
–IN
REF
VDD
VIO
R
–OUT
SDI
IN+
IN–
C
C
AD4020/
AD4021/
AD4022
SCK
V
/2
DIGITAL HOST
(MICROPROCESSOR/
FPGA)
REF
V
OCM
SDO
CNV
+OUT
0.1µF
R
DIFFERENTIAL
AMPLIFIER
GND
3-WIRE/4-WIRE
INTERFACE
V–
R1
1kΩ
R2
1kΩ
Figure 44. Typical Application Diagram for Single-Ended to Differential Conversion with a Fully Differential Amplifier
Single to Differential Driver
the step must be given adequate time to settle before the ADC
samples the inputs (on the rising edge of CNV). The settling
time error is dependent on the drive circuitry (multiplexer and
ADC driver), RC filter values, and the time when the multiplexer
channels are switched. Switch the multiplexer channels
immediately after tQUIET1 has elapsed from the start of the
conversion to maximize settling time and to prevent corruption
of the conversion result. To avoid conversion corruption, do not
switch the channels during the tQUIET1 time. If the analog inputs
are multiplexed during the quiet conversion time (tQUIET1), the
current conversion is possibly corrupted.
The AD4020/AD4021/AD4022 requires a differential input
signal for proper operation. For applications using a single-
ended analog signal, either bipolar or unipolar, a fully differential
amplifier, such as the ADA4940-1 or ADA4945-1, can be used
to convert the single-ended signal to a differential signal, as
shown in Figure 44.
High Frequency Input Signals
The AD4020/AD4021/AD4022 ac performance over a wide
input frequency range is shown in Figure 17 and Figure 20.
Unlike other traditional SAR ADCs, the AD4020/AD4021/
AD4022 maintain exceptional ac performance for input
frequencies up to the Nyquist frequency with minimal
performance degradation. Note that the input frequency is
limited to the Nyquist frequency of the sample rate in use.
EASE OF DRIVE FEATURES
Input Span Compression
In single-supply applications, it is recommended to use the full
range of the ADC. However, the amplifier can have some
headroom and footroom requirements, which can be a problem,
even if it is a rail-to-rail input and output amplifier. The AD4020/
AD4021/AD4022 include a span compression feature that
increases the headroom and footroom available to the amplifier
by reducing the input range by 10% from the top and bottom of the
range while still accessing all available ADC codes (see
Figure 46). The SNR decreases by approximately 1.9 dB (20 ×
log(8/10)) for the reduced input range when span compression is
enabled. Span compression is disabled by default but is enabled by
writing to the relevant register bit (see the Digital Interface
section).
Multiplexed Applications
The AD4020/AD4021/AD4022 significantly reduce system
complexity for multiplexed applications that require superior
performance in terms of noise, power, and throughput. Figure 45
shows a simplified block diagram of a multiplexed data
acquisition system including a multiplexer, an ADC driver, and the
precision SAR ADC.
MULTIPLEXER
R
ADC
SAR ADC
DRIVER
C
R
90% OF V
= 3.69V
REF
C
DIGITAL OUTPUT
+FSR
C
R
V
= 4.096V
ADC
5V
REF
C
10% OF V
= 0.41V
IN+
REF
N
ALL 2
CODES
Figure 45. Multiplexed Data Acquisition Signal Chain Using the
AD4020/AD4021/AD4022
ANALOG
INPUT
–FSR
Switching multiplexer channels typically results in large voltage
steps at the ADC inputs. To ensure an accurate conversion result,
Figure 46. Span Compression
Rev. B | Page 23 of 39
AD4020/AD4021/AD4022
Data Sheet
100
97
94
91
88
85
82
79
76
73
70
High-Z Mode
The AD4020/AD4021/AD4022 incorporate high-Z mode, which
reduces the nonlinear charge kickback when the capacitor DAC
switches back to the input at the start of acquisition. Figure 28
shows the analog input current of the AD4020/AD4021/AD4022
with high-Z mode enabled and disabled. The low input current
makes the ADC easier to drive than the traditional SAR ADCs
available in the market, even with high-Z mode disabled. The
input current reduces further to submicroampere range when
high-Z mode is enabled. The high-Z mode is disabled by default,
but can be enabled by writing to the configuration register (see
Table 12). Disable high-Z mode for input frequencies above
100 kHz or when multiplexing.
ADA4077-1 HIGH-Z DISABLED
ADA4077-1 HIGH-Z ENABLED
ADA4610-1 HIGH-Z DISABLED
ADA4610-1 HIGH-Z ENABLED
260kHz
1.3kΩ
470pF
498kHz
680Ω
470pF
1.3MHz
680Ω
180pF
2.27MHz
390Ω
180pF
4.42MHz
200Ω
180pF
RC FILTER BANDWIDTH (Hz)
To achieve the optimum data sheet performance from traditional
high resolution precision SAR ADCs, system designers must often
use a dedicated high power, high speed amplifier to drive the
switched capacitor SAR ADC inputs. High-Z mode allows a
choice of lower power and lower bandwidth precision amplifiers
with a lower RC filter cutoff to drive the ADC, removing the need
for dedicated high speed ADC drivers, which saves system power,
size, and cost in precision, low bandwidth applications. High-Z
mode allows the amplifier and RC filter in front of the ADC to
be chosen based on the signal bandwidth of interest, and not
based on the settling requirements of the switched capacitor SAR
ADC inputs. High-Z mode also improves THD performance and
reduces analog input current for input signals up to 100 kHz.
RESISTOR (Ω), CAPACITOR (pF)
Figure 47. SNR vs. RC Filter Bandwidth for Various Precision ADC Drivers,
fIN = 1 kHz (See the Typical Performance Characteristics Section for
Operating Conditions)
–80
–84
–88
–92
–96
–100
–104
–108
Additionally, the AD4020/AD4021/AD4022 can be driven with
a much higher source impedance than traditional SARs, which
means the resistor in the RC filter can have a value 10 times
larger than previous SAR designs and, with high-Z mode enabled,
can tolerate even greater impedance. Figure 26 shows the THD
performance for various source impedances with high-Z mode
disabled and enabled.
–112
ADA4077-1 HIGH-Z DISABLED
ADA4077-1 HIGH-Z ENABLED
–116
ADA4610-1 HIGH-Z DISABLED
ADA4610-1 HIGH-Z ENABLED
–120
260kHz
1.3kΩ
470pF
498kHz
680Ω
470pF
1.3MHz
680Ω
180pF
2.27MHz
390Ω
4.42MHz
200Ω
180pF
180pF
RC FILTER BANDWIDTH (Hz)
RESISTOR (Ω), CAPACITOR (pF)
Figure 48. THD vs. RC Filter Bandwidth for Various Precision ADC Drivers,
fIN = 1 kHz (See the Typical Performance Characteristics Section for
Operating Conditions)
Figure 47 and Figure 48 show the AD4020/AD4021/AD4022 SNR
and THD performance using the ADA4077-1 (supply current
per amplifier (ISY) = 400 μA) and ADA4610-1 (ISY = 1.50 mA)
precision amplifiers when driving the AD4020/AD4021/AD4022
at full throughput for high-Z mode both enabled and disabled
with various RC filter values. These amplifiers achieve +96 dB
to +99 dB typical SNR and close to −110 dB typical THD with
high-Z enabled for a 2.27 MHz RC bandwidth. THD is
approximately 10 dB better with high-Z mode enabled, even for
large R values greater than 200 Ω. SNR maintains close to
99 dB, even with a low RC filter cutoff.
When high-Z mode is enabled, the ADC consumes approximately
2.0 mW per MSPS of extra power. However, this additional power
is still significantly lower than using dedicated ADC drivers like the
ADA4807-1. For any system, the front end usually limits the
overall ac/dc performance of the signal chain. The ADA4077-1
and ADA4610-1 data sheets of the selected precision amplifiers (see
Figure 47 and Figure 48) show that their own noise and
distortion performance dominates the SNR and THD
specification at a certain input frequency.
Long Acquisition Phase
The AD4020/AD4021/AD4022 also feature a fast conversion
time of 320 ns, which results in a long acquisition phase. The
acquisition is further extended by a key feature of the AD4020/
AD4021/AD4022. The ADC returns to the acquisition phase
typically 100 ns before the end of the conversion. This feature
provides an even longer time for the ADC to acquire the new
input voltage. A longer acquisition phase reduces the settling
requirement on the driving amplifier, and a lower power and
Rev. B | Page 24 of 39
Data Sheet
AD4020/AD4021/AD4022
lower bandwidth amplifier can be chosen. The longer acquisition
phase means that a lower RC filter (represented by R and C in
Figure 40 to Figure 42 and Figure 44) cutoff can be used, which
means a noisier amplifier can also be tolerated. A larger value of
R can be used in the RC filter with a corresponding smaller
value of C, reducing amplifier stability concerns without affecting
distortion performance significantly. A larger value of R also
results in reduced dynamic power dissipation in the amplifier.
SDI, CNV, SCK, and SDO signals allows CNV, which initiates
the conversions, to be independent of the readback timing
(SDI). This interface is useful in low jitter sampling or
simultaneous sampling applications. In either 3-wire or 4-wire
CS
mode, a busy signal can be enabled to indicate when the
conversion result is ready. The busy signal acts as an interrupt
to the digital host to initiate data readback.
The AD4020/AD4021/AD4022 digital interface also supports
daisy-chaining multiple devices to read back results from
multiple ADCs over a single SPI bus.
See Table 10 for details on setting the RC filter bandwidth and
choosing a suitable amplifier.
VOLTAGE REFERENCE INPUT
Timing diagrams and explanations for each digital interface
CS
mode are given in the
Mode, 3-Wire Turbo Mode section
A 10 μF (X7R, 0805 size) ceramic chip capacitor is appropriate
for the optimum performance of the reference input.
through the Daisy-Chain Mode section.
Turbo mode allows the use of slower SPI clock rates by extending
the amount of time available to clock out conversion results.
Turbo mode is enabled by setting the turbo mode enable bit to 1 in
the configuration register (see Table 12), and replaces the busy
indicator feature when enabled. The maximum throughput of
1.8 MSPS for the AD4020 can only be achieved with turbo
mode enabled and a minimum SCK frequency of 71 MHz (see
For higher performance and lower drift, use a reference such as
the ADR4550. Using a low power reference such as the ADR3450
can result in a slight decrease in the noise performance. It is
recommended to use a reference buffer, such as the ADA4807-1,
between the reference and the ADC reference input. It is important
to consider the optimum capacitance necessary to keep the
reference buffer stable as well as to meet the minimum ADC
requirement stated previously in this section (that is, a 10 μF
ceramic chip capacitor, CREF).
CS
the Serial Clock Frequency Requirements section). See the
CS
Mode, 3-Wire Turbo Mode section, and
Mode, 4-Wire
Turbo Mode section for descriptions of turbo mode operation.
POWER SUPPLY
Status bits can also be clocked out at the end of the conversion
data if the status bits are enabled in the configuration register
(see the Status Bits section).
The AD4020/AD4021/AD4022 use two power supply pins: a core
supply (VDD) and a digital input/output interface supply (VIO).
VIO allows direct interface with any logic between 1.8 V and
5.5 V. To reduce the number of supplies needed, VIO and VDD
can be tied together for 1.8 V operation. The ADP7118 low noise,
complementary metal-oxide semiconductor (CMOS), low dropout
(LDO) linear regulator is recommended to power the VDD and
VIO pins. The AD4020/AD4021/AD4022 are independent of
power supply sequencing between VIO and VDD. Additionally, the
AD4020/AD4021/AD4022 are insensitive to power supply
rejection variations over a wide frequency range, as shown in
Figure 33.
For isolated systems, the ADuM141D is recommended to
support the 71 MHz SCK frequency required to run the
AD4020 at the full throughput of 1.8 MSPS.
The state of SDO on power-up is either low or high-Z, depending
on the states of CNV and SDI, as shown in Table 11.
Table 11. State of SDO on Power-Up
CNV
SDI
SDO
Low
Low
Low
High-Z
0
0
1
1
0
1
0
1
The AD4020/AD4021/AD4022 automatically power down at the
end of each conversion phase. Therefore, the power scales linearly
with the sampling rate. This feature makes the device ideal for
low sampling rates (even a few samples per second) and battery-
powered applications. Figure 35 shows the AD4020/AD4021/
AD4022 total power dissipation and individual power dissipation
for each rail.
Configuration Register Details
The AD4020/AD4021/AD4022 features are controlled via the
configuration register. The configuration register is eight bits
wide and contains enable bits for the status bits, span compression,
high-Z mode, and turbo mode, as well as an overvoltage detection
flag. 16-bit SPI instructions are used to read from and write to
the contents in the configuration register (see the Configuration
Register Details section). Table 12 shows the locations and
descriptions of each field in the configuration register.
DIGITAL INTERFACE
The AD4020/AD4021/AD4022 digital interface is used to
perform analog to digital conversions and to enable and disable
various features. The AD4020/AD4021/AD4022 are compatible
with SPI, QSPI™, and MICROWIRE digital hosts and DSPs.
SCK must be set with clock polarity (CPOL) = clock phase
(CPHA) = 0. A 3-wire interface using the CNV, SCK, and SDO
signals minimizes wiring connections, which is useful in
applications with digital isolation. A 4-wire interface using the
Rev. B | Page 25 of 39
AD4020/AD4021/AD4022
Data Sheet
Serial Clock Frequency Requirements
where:
The AD4020/AD4021/AD4022 digital interface minimizes the
SCK frequency required for reading back conversion results, even
when operating at a high throughput. The minimum SCK frequen-
cy required for a given application depends on the number of bits
being read on SDO, whether turbo mode is enabled or disabled,
and the throughput in use. See Table 13 for several examples of
SCK frequency requirements for different throughputs.
ND is the ADC resolution (20 bits).
NS is the number of status bits being accessed.
tCYC, tQUIET1, tEN, and tQUIET2 correspond to timing specifications
described in Table 2.
The minimum SCK frequency required to access the conversion
result plus status bits when turbo mode is not enabled is
calculated with the following equation:
The minimum SCK frequency (fSCK) required to access the
conversion result plus status bits when turbo mode is enabled is
calculated with the following equation:
ND + NS
fSCK
>
tCYC − tCONV − tEN − tQUIET2
where tCONV corresponds to the conversion time, and is
described in Table 2.
ND + NS
fSCK
>
tCYC − tQUIET1 − tEN − tQUIET2
Table 12. Configuration Register
Bits Bit Name
[7:5] Reserved
Description
Reset
Access1
R
Reserved memory.
0x0
4
3
2
1
0
Status bits enable
Enables status bits (see the Status Bits section).
0: disables status bits.
1: enables status bits.
0x0
0x0
0x0
0x0
0x1
R/W
Span compression enable
High-Z mode enable
Turbo mode enable
OV clamp flag
Enables span compression (see the Input Span Compression section).
0: disables span compression.
1: enables span compression.
Enables high-Z mode (see the High-Z Mode section).
0: disables high-Z mode.
R/W
R/W
R/W
R
1: enables high-Z mode.
Enables turbo mode.
0: disables turbo mode.
1: enables turbo mode.
Indicates an overvoltage event triggered the input overvoltage clamp circuit (see
the Input Overvoltage Clamp Circuit section). This bit is sticky, and clears only
when read after the overvoltage event has ended.
0: indicates an overvoltage event has occurred.
1: indicates no overvoltage event has occurred.
1 R is read-only and R/W is read/write. Read only bits cannot be updated with a register write operation. R/W bits can be updated with a register write operation.
Table 13. SCK Frequency Requirements for Various Throughputs
CS Mode
Throughput
Minimum SCK Frequency (MHz)
3-Wire and 4-Wire Turbo Modes
1.8 MSPS (AD4020)
71
28
12
2.5
92
36
16
3
98
35
13
2.5
90
45
17
3
1 MSPS (AD4020, AD4021)
500 kSPS (AD4020, AD4021, AD4022)
100 kSPS (AD4020, AD4021, AD4022)
1.8 MSPS (AD4020)
1 MSPS (AD4020, AD4021)
500 kSPS (AD4020, AD4021, AD4020)
100 kSPS (AD4020, AD4021, AD4022)
1.6 MSPS (AD4020)
1 MSPS (AD4020, AD4021)
500 kSPS (AD4020, AD4021, AD4022)
100 kSPS (AD4020, AD4021, AD4022)
1.4 MSPS (AD4020)
1 MSPS (AD4020, AD4021)
500 kSPS (AD4020, AD4021, AD4022)
100 kSPS (AD4020, AD4021, AD4022)
3-Wire and 4-Wire Turbo Modes with Six Status Bits
3-Wire and 4-Wire Modes
3-Wire and 4-Wire Modes with Status Word
Rev. B | Page 26 of 39
Data Sheet
AD4020/AD4021/AD4022
When performing a write operation, the new register contents
are written over SDI MSB first, and the writeable bits in the
configuration register are updated after the device receives the
full byte. When performing a read operation, the current register
contents are shifted out on SDO, MSB first. Figure 49 and
Figure 50 show timing diagrams for register read and write
REGISTER READ/WRITE FUNCTIONALITY
The AD4020/AD4021/AD4022 configuration register is read
from and written to with a 16-bit SPI instruction. The state of
the fields in the configuration register determine which of the
device features are enabled or disabled (see the Configuration
Register Details section).
CS
operations when using any of the
modes. Figure 51 shows
The 16-bit SPI instructions consist of the 8-bit register access
command (see Table 14) followed by the register data. When
performing register read and write operations, CNV is analogous
to a chip select signal, and CNV must be brought low to access
the configuration register contents. Data on SDI is latched in on
each SCK rising edge. Data is shifted out on SDO on each SCK
falling edge. SDO returns to a high impedance state when CNV
is brought high.
the timing diagram for performing a write operation to multiple
devices connected in daisy-chain mode.
Register reads are not supported when daisy-chaining multiple
devices (see the Daisy-Chain Mode section). To verify the contents
of the configuration register, enable and read the status bits (see
the Status Bits section).
The LSB of the configuration register (Bit 0) is a read only bit
that allows digital hosts to ensure the desired digital interface
mode is selected in the frame immediately following a register
write operation. For digital hosts that are limited to 16-bit SPI
frames (such as some microcontrollers), set this bit accordingly
to ensure SDI is at the desired level on the rising edge of CNV.
For example, set this bit to 1 and/or set the idle state of SDI to 1
The first bit read on SDI after a CNV falling edge (represented
WEN
by
in Table 14) must be a 0 to initiate the register access
W
command. The next bit (R/ ) determines whether the instruction
is a write or a read. The following six bits must match the values
for Bit 5 through Bit 0, shown in Table 14, to perform the SPI
read/write.
CS
when using any of the
modes.
SPI write instructions can be performed in the same frame as
reading a conversion result. To ensure the conversion is
executed correctly, the CNV signal must obey the timing
requirements for the selected interface mode.
Table 14. Register Access Command
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
WEN
R/W
0
1
0
1
0
0
tCYC
1
tSCK
tCNVH
CNV
SCK
2
tSCNVSCK
tSCKL
tQUIET2
1
2
3
4
5
9
10
11
12
13
14
15
16
6
7
8
tSCKH
tSSDISCK
tHSDISCK
WEN
(0)
R/W
(1)
SDI
1
1
0
1
0
1
0
0
tDIS
8-BIT REGISTER ACCESS COMMAND
tDSDO
tHSDO
tEN
3
X
SDO
D19
D18
D17
D16
D15
D14
D13
D12
B7
B6
B5
B4
B3
B2
B1
B0
REGISTER DATA ON B7 TO B0
1
2
3
THE CNV HIGH TIME MUST FOLLOW THE tCONV SPECIFICATION TO GENERATE A VALID CONVERSION RESULT.
THE SCK FALLING EDGE TO CNV RISING EDGE DELAY MUST FOLLOW THE tQUIET2 SPECIFICATION TO ENSURE SPECIFIED PERFORMANCE.
X MEANS DON’T CARE.
Figure 49. Register Read Timing Diagram
Rev. B | Page 27 of 39
AD4020/AD4021/AD4022
Data Sheet
tCYC
1
tCNVH
tSCK
tHCNVSCK
CNV
tSCKL
tSCNVSCK
2
tQUIET2
SCK
1
2
3
4
5
9
10
11
12
13
14
15
16
17
18
19
20
6
7
8
tSCKH
tSSDISCK
tHSDISCK
WEN R/W
(0) (0)
SDI
1
0
1
0
1
0
0
B7
B6
B5
B4
B3
B2
B1
B0
1
8-BIT REGISTER ACCESS COMMAND
REGISTER DATA ON B7 TO B0
tDIS
tDSDO
tHSDO
tEN
SDO
D19
D18
D17
D16
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
CONVERSION RESULT ON D19 TO D0
1
2
THE CNV HIGH TIME MUST FOLLOW THE tCONV SPECIFICATION TO GENERATE A VALID CONVERSION RESULT.
THE SCK FALLING EDGE TO CNV RISING EDGE DELAY MUST FOLLOW THE tQUIET2 SPECIFICATION TO ENSURE SPECIFIED PERFORMANCE.
Figure 50. Register Write Timing Diagram
tCYC
tCNVH
tSCK
CNV
SCK
tSCNVSCK
tSCKL
1
24
tSCKH
SDI
0
A
0
COMMAND (0x14)
DATA (0xAB)
SDO /SDI
A
0
COMMAND (0x14)
DATA (0xAB)
0
B
tDIS
SDO
B
0
COMMAND (0x14)
0
Figure 51. Register Write Timing Diagram, Daisy-Chain Mode
Rev. B | Page 28 of 39
Data Sheet
AD4020/AD4021/AD4022
Table 15. Status Bits Descriptions
STATUS BITS
Bit
Bit Name
Description
A set of six optional status bits can be appended to the end of
each conversion result. The status bits allow the digital host to
check the state of the input overvoltage protection circuit and
verify that the ADC features are configured correctly without
interrupting conversions. The status bits are enabled when the
status bits enable bit in the configuration register is set to 1 (see
Configuration Register Details section). Table 15 shows a
description of each status bit.
5
OV clamp flag
Indicates the state of the OV
clamp flag in the configuration
register.
4
Span compression
High-Z mode
Turbo mode
Reserved
Indicates the state of the span
compression enable bit in the
configuration register.
3
Indicates the state of the High-Z
mode enable bit in the
configuration register.
When enabled, the status bits are clocked out MSB first starting
on the SCK falling edge immediately following the LSB of the
conversion result. The SDO line returns to high impedance
after the sixth status bit is clocked out (except in daisy-chain
mode). The user is not required to clock out all status bits to
start the next conversion. For example, if the digital host needs
2
Indicates the state of the turbo
mode enable bit in the
configuration register.
[1:0]
Reserved.
OV
to monitor the
clamp flag but also needs to minimize the
SCK frequency, the remaining status bits can be ignored to limit
the number of SCK pulses required per conversion period.
When using multiple AD4020/AD4021/AD4022 devices in
daisy-chain mode, however, all six status bits must be clocked
out for each connected device.
CS
Figure 52 shows the serial interface timing for
mode, 3-wire
without busy indicator with all six status bits, Bits[5:0] (see
Figure 52), clocked out.
SDI = 1
tCYC
tCNVH
CNV
tACQ
ACQUISITION
CONVERSION
tCONV
ACQUISITION
tSCK
tQUIET2
tSCKL
SCK
24
25
26
20
1
2
3
18
19
t
tSCKH
HSDO
tEN
tDSDO
tDIS
SDO
B1
B0
D19
D18
D17
D1
D0
STATUS BITS B[5:0]
CS
Figure 52. Mode, 3-Wire Without Busy Indicator Serial Interface Timing Diagram Including Status Bits
Rev. B | Page 29 of 39
AD4020/AD4021/AD4022
Data Sheet
When performing conversions in this mode, SDI must be held
high, a CNV rising edge initiates a conversion and forces SDO
to high impedance. The user must wait tQUIET1 time after the
CNV rising edge before bringing CNV low to clock out the
previous conversion result. When the conversion is complete
(after tCONV), the AD4020/AD4021/AD4022 enter the
acquisition phase and power down.
CS MODE, 3-WIRE TURBO MODE
This mode is typically used when a single AD4020/AD4021/
AD4022 device is connected to an SPI-compatible digital host.
Turbo mode allows lower SCK frequencies by increasing the
time that the ADC conversion result can be clocked out. The
AD4020 can achieve a throughput rate of 1.8 MSPS only when
turbo mode is enabled and using a minimum SCK rate of 71 MHz
(see the Serial Clock Frequency Requirements section). The
connection diagram is shown in Figure 53, and the corresponding
timing diagram is shown in Figure 54.
When CNV goes low, the MSB is output to SDO. The remaining
data bits are clocked by subsequent SCK falling edges. The data
is valid on both SCK edges. Although the rising edge can capture
the data, a digital host using the SCK falling edge allows a faster
reading rate, provided it has an acceptable hold time, as dictated by
tHSDO (see Table 2). If the status bits are not enabled, SDO returns to
high impedance after the 16th SCK falling edge. If the status bits
are enabled, they are shifted out on SDO on the 17th through the
22nd SCK falling edges (see the Status Bits section). SDO returns
to high impedance after the final SCK falling edge, or when
CNV goes high (whichever occurs first). The user must also
provide a delay of tQUIET2 between the final SCK falling edge and
the next CNV rising edge to ensure specified performance.
To enable turbo mode, set the turbo mode enable bit in the
configuration register to 1 (see Table 12). This mode replaces
the 3-wire with busy indicator mode when turbo mode is enabled.
Writing to the user configuration register requires SDI to be
connected to the digital host (see the Register Read/Write
Functionality section). When turbo mode is enabled, the
conversion result read on SDO corresponds to the result of the
previous conversion.
DATA OUT
CONVERT
DIGITAL HOST
DATA IN
CNV
AD4020/
SDI
SDO
AD4021/
AD4022
SCK
CLK
CS
Figure 53. Mode, 3-Wire Turbo Mode Connection Diagram
SDI = 1
CNV
tCYC
tACQ
ACQUISITION
CONVERSION
ACQUISITION
tCONV
tSCK
tSCKL
tQUIET1
tQUIET2
SCK
1
2
3
18
19
20
tSCKH
HSDO
tDSDO
tDIS
tEN
SDO
D19
D18
D17
D1
D0
CS
Figure 54. Mode, 3-Wire Turbo Mode Serial Interface Timing Diagram (Status Bits Not Shown)
Rev. B | Page 30 of 39
Data Sheet
AD4020/AD4021/AD4022
conversion time to avoid generating the busy signal indicator.
When the conversion is complete, the AD4020/AD4021/AD4022
enter the acquisition phase and power down. There must not be
any digital activity on SCK during the conversion.
CS MODE, 3-WIRE WITHOUT THE BUSY INDICATOR
This mode is typically used when a single AD4020/AD4021/
AD4022 device is connected to an SPI-compatible digital host.
The connection diagram is shown in Figure 55, and the
corresponding timing diagram is shown in Figure 56.
When CNV goes low, the MSB is output onto SDO. The
remaining data bits are clocked out on SDO by subsequent SCK
falling edges. The data is valid on both SCK edges. Although the
rising edge can capture the data, a digital host using the SCK
falling edge allows a faster reading rate, provided it has an
acceptable hold time, as dictated by tHSDO (see Table 2). If the
status bits are not enabled, SDO returns to high impedance after
the 20th SCK falling edge. If the status bits are enabled, they are
shifted out on SDO on the 21st through the 26th SCK falling
edges (see the Status Bits section). SDO returns to high
impedance after the final SCK falling edge, or when CNV goes
high (whichever occurs first).
Turbo mode must be disabled to use this mode. To disable turbo
mode, set the turbo mode enable bit in the configuration register
to 0 (see Table 12). Turbo mode is disabled by default.
When performing conversions in this mode, SDI must be held
high. SDI can be connected to VIO if register reading and writing is
not required. A rising edge on CNV initiates a conversion and
forces SDO to high impedance. After a conversion is initiated, it
continues until completion, irrespective of the state of CNV. This
feature can be useful when bringing CNV low to select other
SPI devices, such as analog multiplexers. However, CNV must
be returned high before the minimum conversion time (tCONV
)
elapses and then held high for the maximum possible
CONVERT
DIGITAL HOST
CNV
VIO
AD4020/
1
SDI
AD4021/
DATA IN
SDO
AD4022
SCK
CLK
1
SDI MUST BE CONNECTED TO THE DIGITAL HOST DATA OUT
TO WRITE TO THE CONFIGURATION REGISTER.
CS
Figure 55. Mode, 3-Wire Without Busy Indicator Connection Diagram
SDI = 1
tCYC
tCNVH
CNV
tACQ
ACQUISITION
CONVERSION
ACQUISITION
tSCK
tCONV
tSCKL
tQUIET2
SCK
1
2
3
18
19
20
tSCKH
HSDO
tEN
tDSDO
tDIS
SDO
D19
D18
D17
D1
D0
CS
Figure 56. Mode, 3-Wire Without the Busy Indicator Serial Interface Timing Diagram (Status Bits Not Shown)
Rev. B | Page 31 of 39
AD4020/AD4021/AD4022
Data Sheet
then enter the acquisition phase and power down. There must not
be any digital activity on the SCK during the conversion.
CS MODE, 3-WIRE WITH THE BUSY INDICATOR
This mode is typically used when a single AD4020/AD4021/
AD4022 device is connected to an SPI-compatible digital host
When the conversion is complete, SDO is driven low. With a
pull-up resistor (for example, 1 kΩ) on the SDO line, this
transition can be used as an interrupt signal to initiate the data
reading controlled by the digital host. The data bits are then
clocked out MSB first on SDO by subsequent SCK falling edges.
The data is valid on both SCK edges. Although the rising edge
can capture the data, a digital host using the SCK falling edge
allows a faster reading rate, provided it has an acceptable hold
time, as dictated by tHSDO (see Table 2). The conversion result is
clocked out on SDO on the first 20 SCK falling edges. If the status
bits are enabled, they are clocked out on SDO on the 21st through
the 26th SCK falling edges (see the Status Bits section). SDO
returns to high impedance after an optional additional SCK
falling edge or the next CNV rising edge (whichever occurs first).
IRQ
with an interrupt input (
). The connection diagram is
shown in Figure 57, and the corresponding timing diagram is
shown in Figure 58.
Turbo mode must be disabled to use this mode. To disable turbo
mode, set the turbo mode enable bit in the configuration
register to 0 (see Table 12). Turbo mode is disabled by default.
When performing conversions in this mode, SDI must be held
high. SDI can be connected to VIO if register reading and writing
is not required. A rising edge on CNV initiates a conversion and
forces SDO to high impedance. SDO remains high impedance
until the completion of the conversion, irrespective of the state of
CNV. Prior to the minimum conversion time, CNV can select
other SPI devices, such as analog multiplexers. However, CNV
must be returned low before the minimum conversion time
(tCONV) elapses and then held low for the maximum possible
conversion time to guarantee generating the busy signal indicator.
When the conversion is complete, the AD4020/AD4021/AD4022
If multiple AD4020/AD4021/AD4022 devices are selected at the
same time, the SDO output pin handles this contention without
damage or induced latch-up. It is recommended to keep this
contention as short as possible to limit extra power dissipation.
CONVERT
VIO
1kΩ
DIGITAL HOST
CNV
VIO
AD4020/
AD4021/
AD4022
1
SDO
DATA IN
SDI
IRQ
SCK
CLK
1
SDI MUST BE CONNECTED TO THE DIGITAL HOST DATA OUT
TO WRITE TO THE CONFIGURATION REGISTER.
CS
Figure 57. Mode, 3-Wire with Busy Indicator Connection Diagram
SDI = 1
tCYC
tCNVH
CNV
tACQ
ACQUISITION
CONVERSION
tCONV
ACQUISITION
tSCK
tSCKL
tQUIET2
SCK
1
2
3
19
20
21
tHSDO
tSCKH
tDSDO
tDIS
SDO
D19
D18
D1
D0
CS
Figure 58. Mode, 3-Wire with the Busy Indicator Serial Interface Timing Diagram (Status Bits Not Shown)
Rev. B | Page 32 of 39
Data Sheet
AD4020/AD4021/AD4022
conversion and data readback phase. When performing
CS MODE, 4-WIRE TURBO MODE
conversions in this mode, SDI must be high during the CNV
rising edge. The user must wait tQUIET1 time after the CNV rising
edge before bringing SDI low to clock out the previous conversion
result. When the conversion is complete (after tCONV), the AD4020/
AD4021/AD4022 enter the acquisition phase and power down.
This mode is typically used when a single AD4020/4021/4022
device is connected to an SPI-compatible digital host. Turbo
mode allows lower SCK frequencies by increasing the time that the
ADC conversion result can be clocked out. The AD4020 can
achieve a throughput rate of 1.8 MSPS only when turbo mode is
enabled and using a minimum SCK frequency of 71 MHz (see the
Serial Clock Frequency Requirements section). The connection
diagram is shown in Figure 59, and the corresponding timing
diagram is shown in Figure 60.
SDI is analogous to a chip select input, and bringing SDI low
outputs the MSB of the conversion result on SDO. The remaining
data bits are clocked out on SDO by subsequent SCK falling
edges. The data is valid on both SCK edges. Although the rising
edge can capture the data, a digital host using the SCK falling
edge allows a faster reading rate, provided it has an acceptable
hold time, as dictated by tHSDO (see Table 2). The conversion
result is clocked out on SDO on the first 20 SCK falling edges. If
the status bits are enabled, they are shifted out on SDO on the
21st through the 26th SCK falling edges (see the Status Bits section).
SDO returns to high impedance after the final SCK falling edge,
or when CNV goes high (whichever occurs first). The user must
also provide a delay of tQUIET2 between the final SCK falling edge
and the next CNV rising edge to ensure specified performance.
To enable turbo mode, set the turbo mode enable bit in the
configuration register to 1 (see Table 12). This mode replaces the
4-wire with busy indicator mode when turbo mode is enabled. The
digital host must be able to write data over SDI to perform register
reads and writes (see the Register Read/Write Functionality
section). When turbo mode is enabled, the conversion result read
on SDO corresponds to the result of the previous conversion.
A rising edge on CNV initiates a conversion and forces SDO to
high impedance. CNV must be held high throughout the
DATA OUT
CONVERT
DIGITAL HOST
DATA IN
CNV
AD4020/
SDI
SDO
AD4021/
AD4022
SCK
CLK
CS
Figure 59. Mode, 4-Wire Turbo Mode Connection Diagram
CNV
tCYC
tSSDICNV
SDI
tHSDICNV
tACQ
ACQUISITION
CONVERSION
tCONV
ACQUISITION
tSCK
tSCKL
tQUIET2
tQUIET1
SCK
1
2
3
18
19
20
tHSDO
tSCKH
tDIS
tEN
tDSDO
SDO
D19
D18
D17
D1
D0
CS
Figure 60. Mode, 4-Wire Turbo Mode Timing Diagram (Status Bits Not Shown)
Rev. B | Page 33 of 39
AD4020/AD4021/AD4022
Data Sheet
busy signal indicator. When the conversion is complete, the
CS MODE, 4-WIRE WITHOUT THE BUSY INDICATOR
AD4020/AD4021/AD4022 enter the acquisition phase and
power down. There must not be any digital activity on SCK
during the conversion.
This mode is typically used when multiple AD4020/AD4021/
AD4022 devices are connected to an SPI-compatible digital
host. A connection diagram using two AD4020/AD4021/AD4022
devices is shown in Figure 61, and the corresponding timing
diagram is shown in Figure 62.
SDI is analogous to a chip select input and each ADC result can
be read by bringing the corresponding SDI input low. Bringing
SDI low on each device outputs the MSB of the conversion
result on the corresponding SDO pin. The remaining data bits
are clocked out on SDO by subsequent SCK falling edges. The
data is valid on both SCK edges. The conversion result is clocked
out on SDO on the first 20 SCK falling edges. If the status bits
are enabled, they are shifted out on SDO on the 21st through the
26th SCK falling edges (see the Status Bits section). SDO returns to
high impedance after the final SCK falling edge, or when SDI goes
high (whichever occurs first). If the SDO of each device is tied
together, ensure SDI is only low for one device at a time. The
user must also provide a delay of tQUIET2 between the final SCK
falling edge and the next CNV rising edge to ensure specified
performance.
Turbo mode must be disabled to use this mode. To disable turbo
mode, set the turbo mode enable bit in the configuration
register to 0 (see Table 12). Turbo mode is disabled by default.
A rising edge on CNV initiates a conversion and forces SDO to
high impedance. When performing conversions in this mode,
SDI must be high during the CNV rising edge. CNV must be
held high throughout the conversion and data readback phase.
When performing conversions in this mode, SDI must be high
during the CNV rising edge. Prior to the minimum conversion
time (tCONV), SDI can select other SPI devices, such as analog
multiplexers. However, SDI must be returned high before the
minimum conversion time elapses and then held high for the
maximum possible conversion time to avoid generating the
CS2
CS1
CONVERT
CNV
CNV
AD4020/
AD4021/
AD4020/
AD4021/
AD4022
DEVICE B
DIGITAL HOST
SDI
SDO
SDI
SDO
AD4022
DEVICE A
SCK
SCK
DATA IN
CLK
CS
Figure 61. Mode, 4-Wire Without Busy Indicator Connection Diagram
CYC
CNV
tACQ
ACQUISITION
tSSDICNV
CONVERSION
tCONV
ACQUISITION
tQUIET2
SDI(CS1)
tHSDICNV
SDI(CS2)
SCK
tSCK
tSCKL
1
2
3
18
19
20
21
22
38
39
40
tHSDO
t
SCKH
tDSDO
D17
tDIS
tEN
SDO
D19
D18
D1
D0
D19
D18
D1
D0
CS
Figure 62. Mode, 4-Wire Without the Busy Indicator Serial Interface Timing Diagram (Status Bits Not Shown)
Rev. B | Page 34 of 40
Data Sheet
AD4020/AD4021/AD4022
minimum conversion time elapses and then held low for the
maximum possible conversion time to guarantee generating the
busy signal indicator. When the conversion is complete, the
AD4020/AD4021/AD4022 enter the acquisition phase and
power down. There must not be any digital activity on SCK
during the conversion.
CS MODE, 4-WIRE WITH THE BUSY INDICATOR
This mode is typically used when a single AD4020/AD4021/
AD4022 device is connected to an SPI-compatible digital host
IRQ
with an interrupt input (
), and when CNV, which samples
the analog input, is required to be independent of the signal
used to select the data reading. This independence is particularly
important in applications where low jitter on CNV is desired.
The connection diagram is shown in Figure 63, and the
corresponding timing is shown in Figure 64.
When the conversion is complete, SDO is driven low. With a
pull-up resistor (for example, 1 kΩ) on the SDO line, this
transition can be used as an interrupt signal to initiate the data
reading controlled by the digital host. The data bits are then
clocked out MSB first on SDO by subsequent SCK falling edges.
The data is valid on both SCK edges. Although the rising edge
can capture the data, a digital host using the SCK falling edge
allows a faster reading rate, provided it has an acceptable hold
time, as dictated by tHSDO (see Table 2). The conversion result is
clocked out on SDO on the first 20 SCK falling edges. If the
status bits are enabled, they are clocked out on SDO on the 21st
through the 26th SCK falling edges (see the Status Bits section).
SDO returns to high impedance after an optional additional
SCK falling edge or the next CNV rising edge (whichever
occurs first).
Turbo mode must be disabled to use this mode. To disable turbo
mode, set the turbo mode enable bit in the configuration
register to 0 (see Table 12). Turbo mode is disabled by default.
A rising edge on CNV initiates a conversion and forces SDO to
high impedance. When performing conversions in this mode,
SDI must be high during the CNV rising edge. CNV must be
held high throughout the conversion and data readback phase.
When performing conversions in this mode, SDI must be high
during the CNV rising edge. Prior to the minimum conversion
time (tCONV), SDI can select other SPI devices, such as analog
multiplexers. However, SDI must be returned low before the
CS1
CONVERT
VIO
1kΩ
CNV
DIGITAL HOST
AD4020/
AD4021/
AD4022
DATA IN
SDO
SDI
IRQ
SCK
CLK
CS
Figure 63. Mode, 4-Wire with Busy Indicator Connection Diagram
tCYC
CNV
tACQ
ACQUISITION
CONVERSION
ACQUISITION
tCONV
t
QUIET2
tSSDICNV
SDI
tSCK
tHSDICNV
tSCKL
SCK
SDO
1
2
3
19
20
21
tHSDO
tDSDO
tSCKH
tDIS
tEN
D19
D18
D1
D0
CS
Figure 64. Mode, 4-Wire with the Busy Indicator Serial Interface Timing Diagram (Status Bits Not Shown)
Rev. B | Page 35 of 39
AD4020/AD4021/AD4022
Data Sheet
ADC, SDI feeds the input of the internal shift register and is
clocked in on each SCK rising edge. Results are therefore passed
through each device until they are all received by the digital
host. When the status bits are disabled, 20 × N clocks are required
to read back N ADCs. When the status bits are enabled, 26 × N
clocks are required to read back the conversion data and status
bits for N ADCs. The data is valid on both SCK edges.
DAISY-CHAIN MODE
Use this mode to daisy-chain multiple AD4020/AD4021/AD4022
devices on a 3-wire or 4-wire serial interface. This feature is useful
for reducing component count and wiring connections such as
cases with isolated multiconverter applications or for systems
with a limited interfacing capacity. Data readback is analogous
to clocking a shift register. A connection diagram example using
two AD4020/AD4021/AD4022 devices is shown in Figure 65,
and the corresponding timing diagram is shown in Figure 66.
The maximum achievable conversion rate when using daisy-chain
mode is typically less than when reading a single device because
the number of bits to clock out is larger (see the Serial Clock
Frequency Requirements section).
Turbo mode must be disabled to use this mode. To disable turbo
mode, set the turbo mode enable bit in the configuration
register to 0 (see Table 12). Writing to the user configuration
register requires SDI to be connected to the digital host (see the
Register Read/Write Functionality section). Turbo mode is
disabled by default.
It is possible to write to each ADC register in daisy-chain mode.
The timing diagram is shown in Figure 51. This mode requires
4-wire operation because data is clocked in on the SDI line with
CNV held low. The same command byte and register data can
be shifted through the entire chain to program all ADCs in the
chain with the same register contents, which requires 8 × (N + 1)
clocks for N ADCs. It is possible to write different register contents
to each ADC in the chain by first writing to the furthest ADC in
the chain first, using 8 × (N + 1) clocks, and then the second
furthest ADC with 8 × N clocks, and so forth until reaching the
nearest ADC in the chain, which requires 16 clocks for the
command and register data. It is not possible to read register
contents in daisy-chain mode.
When SDI and CNV are low, SDO is driven low. A rising edge
on CNV initiates a conversion and SDO remains low. When
performing conversions in this mode, SDI and SCK must be
low during the CNV rising edge. CNV must be held high
throughout the conversion and data readback phase.
When the conversion is complete, the MSB is output onto SDO
of each device, and the AD4020/AD4021/AD4022 enter the
acquisition phase and power down. The remaining data bits are
clocked out on SDO by subsequent SCK falling edges. For each
CONVERT
CNV
CNV
DIGITAL HOST
AD4020/
AD4020/
AD4021/
AD4022
DEVICE B
AD4021/
1
SDI
SDO
SDI
SDO
DATA IN
AD4022
DEVICE A
SCK
SCK
CLK
1
SDI MUST BE CONNECTED TO THE DIGITAL HOST DATA OUT TO WRITE TO THE CONFIGURATION REGISTER.
Figure 65. Daisy-Chain Mode, Connection Diagram
SDI = 0
A
tCYC
CNV
tACQ
ACQUISITION
CONVERSION
ACQUISITION
tSCK
tCONV
tQUIET2
tSCKL
tQUIET2
SCK
1
2
3
18
19
20
21
22
38
39
40
tHSCKCNV
tSSDISCK
tSCKH
tHSDISCK
tEN
D
19
D
18
D
17
D
1
D
0
SDO = SDI
A
A
A
A
A
A
B
tHSDO
tDSDO
tDIS
D
19
D
18
D
17
D
1
D
0
D
19
D
18
D
1
D 0
A
SDO
B
B
B
B
B
A
A
A
B
Figure 66. Daisy-Chain Mode Serial Interface Timing Diagram (Status Bits Not Shown)
Rev. B | Page 36 of 39
Data Sheet
AD4020/AD4021/AD4022
LAYOUT GUIDELINES
EVALUATING THE AD4020/AD4021/AD4022
PERFORMANCE
The PCB that houses the AD4020/AD4021/AD4022 must be
designed so that the analog and digital sections are physically
separated, such as on opposite sides of the device as shown in
Figure 67. The pinout of the AD4020/AD4021/AD4022, with
the analog signals on the left side and the digital signals on the
right side, helps to separate the analog and digital signals.
Other recommended layouts for the AD4020/AD4021/AD4022
are outlined in the user guide of the evaluation board for the
AD4020 (EVAL-AD4020FMCZ). The evaluation board package
includes a fully assembled and tested evaluation board with the
AD4020, the UG-1042 user guide, and software for controlling
the board from a PC via the EVAL-SDP-CH1Z. The EVAL-
AD4020FMCZ can also be used to evaluate the AD4021/AD4022
by limiting the throughput to 1 MSPS and 500 kSPS, respectively,
in the software (see UG-1042 for more information).
Avoid running digital lines under the device because they couple
noise onto the die, unless a ground plane under the AD4020/
AD4021/AD4022 is used as a shield. Fast switching signals,
such as CNV or clocks, must not run near analog signal paths.
Avoid crossover of digital and analog signals.
At least one ground plane must be used. The ground plane can
be common or split between the digital and analog sections. In
the latter case, join the planes underneath the
AD4020/AD4021/AD4022 devices.
The AD4020/AD4021/AD4022 voltage reference input (REF)
has a dynamic input impedance. Decouple the REF pin with
minimal parasitic inductances by placing the reference decoupling
ceramic capacitor close to (ideally right up against) the REF and
GND pins, and connect them with wide, low impedance traces.
Finally, decouple the VDD and VIO power supplies of the
AD4020/AD4021/AD4022 with ceramic capacitors, typically
0.1 µF, placed close to the AD4020/AD4021/AD4022 and
connected using short, wide traces to provide low impedance paths
and to reduce the effect of glitches on the power supply lines.
Figure 67. Example Layout of the AD4020 (Top Layer)
An example of the AD4020 layout following these rules is
shown in Figure 67 and Figure 68. Note that the AD4021/AD4022
layout is equivalent to the AD4020 layout.
Figure 68. Example Layout of the AD4020 (Bottom Layer)
Rev. B | Page 37 of 39
AD4020/AD4021/AD4022
OUTLINE DIMENSIONS
Data Sheet
3.10
3.00
2.90
10
1
6
5
5.15
4.90
4.65
3.10
3.00
2.90
PIN 1
IDENTIFIER
0.50 BSC
0.95
0.85
0.75
15° MAX
1.10 MAX
0.70
0.55
0.40
0.15
0.05
0.23
0.13
6°
0°
0.30
0.15
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-BA
Figure 69. 10-Lead Mini Small Outline Package [MSOP]
(RM-10)
Dimensions shown in millimeters
DETAIL A
(JEDEC 95)
2.48
2.38
2.23
3.10
3.00 SQ
0.50 BSC
2.90
10
6
PIN 1
INDICATOR
AREA
EXPOSED
PAD
1.74
1.64
1.49
0.50
0.40
0.30
0.20 MIN
PIN 1
INDICATOR AR EA OP T
(SEE DETAIL A)
1
5
BOTTOM VIEW
TOP VIEW
SIDE VIEW
IONS
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.80
0.75
0.70
0.05 MAX
0.02 NOM
COPLANARITY
0.08
SECTION OF THIS DATA SHEET.
0.30
0.25
0.20
SEATING
PLANE
0.20 REF
Figure 70. 10-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-10-9)
Dimensions shown in millimeters
Rev. B | Page 38 of 39
Data Sheet
AD4020/AD4021/AD4022
ORDERING GUIDE
Integral
Ordering Package Marking
Model1, 2
Nonlinearity (INL) Temperature Range Package Description
Quantity
Option
Code
AD4020BRMZ
3.1 ppm
3.1 ppm
3.1 ppm
3.1 ppm
3.1 ppm
3.1 ppm
3.1 ppm
3.1 ppm
3.1 ppm
3.1 ppm
3.1 ppm
3.1 ppm
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
10-Lead MSOP, Tube
10-Lead MSOP, Reel
10-Lead LFCSP, Reel
10-Lead LFCSP, Reel
10-Lead MSOP, Tube
10-Lead MSOP, Reel
10-Lead LFCS P, Reel
10-Lead LFCSP, Reel
10-Lead MSOP, Tube
10-Lead MSOP, Reel
10-Lead LFCSP, Reel
10-Lead LFCSP, Reel
50
1000
250
1500
50
1000
250
1500
50
1000
250
RM-10
RM-10
CP-10-9
CP-10-9
RM-10
C8L
C8L
C8L
C8L
AD4020BRMZ-RL7
AD4020BCPZ-R2
AD4020BCPZ-RL7
AD4021BRMZ
AD4021BRMZ-RL7
AD4021BCPZ-R2
AD4021BCPZ-RL7
AD4022BRMZ
AD4022BRMZ-RL7
AD4022BCPZ-R2
AD4022BCPZ-RL7
EVAL-AD4020FMCZ
CAD
CAD
CAC
CAC
CAF
CAF
CAE
CAE
RM-10
CP-10-9
CP-10-9
RM-10
RM-10
CP-10-9
CP-10-9
1500
AD4020 Evaluation Board
Compatible with EVAL-SDP-CH1Z
1 Z = RoHS Compliant Part.
2 The EVAL-AD4020FMCZ can evaluate the AD4021 and AD4022 by setting the throughput to 1 MSPS and 500 kSPS in its software, respectively (see the UG-1042).
©2017–2019 Analog Devices, Inc. All rights reserved. Trademarks
and registered trademarks are the property of their respective owners.
D15369-0-11/19(B)
Rev. B | Page 39 of 39
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