5962R9863602VPX [ADI]
IC OP-AMP, 2500 uV OFFSET-MAX, CDIP8, CERAMIC, DIP-8, Operational Amplifier;
| 型号： | 5962R9863602VPX |
| 厂家： | 
ADI |
| 描述： | IC OP-AMP, 2500 uV OFFSET-MAX, CDIP8, CERAMIC, DIP-8, Operational Amplifier 放大器 CD |
| 文件： | 总13页 (文件大小：76K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
REVISIONS
LTR
A
DESCRIPTION
Make change to input offset current test as specified in table I. - ro
DATE (YR-MO-DA)
99-10-25
APPROVED
R. MONNIN
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
REV
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
A
9
A
A
A
SHEET
10
11
12
PMIC N/A
PREPARED BY
RICK OFFICER
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
CHECKED BY
RAJESH PITHADIA
STANDARD
MICROCIRCUIT
DRAWING
APPROVED BY
RAYMOND MONNIN
MICROCIRCUIT, LINEAR, RADIATION HARDENED
JFET-INPUT OPERATIONAL
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMPLIFIER, MONOLITHIC SILICON
DRAWING APPROVAL DATE
98-10-08
AMSC N/A
REVISION LEVEL
A
SIZE
A
CAGE CODE
5962-98636
67268
SHEET
1
OF
12
DSCC FORM 2233
APR 97
5962-E022-00
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
R
98636
01
V
G
X
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
/
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
Generic number
PM155A
Circuit function
01
02
Radiation hardened JFET input
operational amplifier
Radiation hardened JFET input
operational amplifier
PM156A
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN
class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Q or V
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
G
P
MACY1-X8
GDIP1-T8 or CDIP2-T8
8
8
Can
Dual-in-line
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-98636
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
A
2
DSCC FORM 2234
APR 97
1.3 Absolute maximum ratings. 1/
Supply voltage range (±VS).....................................................±22 V
Input voltage range (VIN) .........................................................±20 V 2/
Differential input voltage range................................................±40 V
Power dissipation (PD).............................................................670 mW
Output short circuit duration....................................................Unlimited 3/
Junction temperature (TJ) .......................................................175°C 4/
Storage temperature range.....................................................-65°C to +150°C
Lead temperature (soldering, 60 seconds).............................300°C
Thermal resistance, junction-to-case (qJC)..............................See MIL-STD-1835
Thermal resistance, junction-to-ambient (qJA):
Case G.................................................................................150°C/W
Case P .................................................................................120°C/W
1.4 Recommended operating conditions.
Supply voltage range (±VS).....................................................±5 V dc to 20 V dc
Ambient temperature range (TA).............................................-55°C to +125°C
1.5 Radiation features.
Total dose................................................................................£ 100 Krads
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of
this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue
of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883
MIL-STD-973
-
-
Test Method Standard Microcircuits.
Configuration Management.
MIL-STD-1835 - Interface Standard For Microcircuit Case Outlines.
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ The absolute maximum negative input voltage is equal to the negative power supply voltage.
3/ Short circuit may be to ground or either supply. Rating applies to +125°C case temperature or +75°C ambient temperature.
4/ For short term test (in the specific burn-in and life test configuration when required and up to 168°C hours maximum),
TJ = 275°C.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-98636
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
A
3
DSCC FORM 2234
APR 97
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's).
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device
class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be as specified on figure 2.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical
performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient
operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests
for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked
as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the
manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator
shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M
shall be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed
manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing
shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or
for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-98636
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
A
4
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Conditions
-55°C £ TA £ +125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits
Max
Unit
Test
Symbol
VIO
Min
-2
Input offset voltage
1
All
2
mV
±VS = ±5 V, VCM = 0 V
2,3
-2.5
2.5
±VS = ±20 V,
VCM = ±15 V , 0 V
M,D,P,L,R 1/
1
-2
2
Input offset voltage 2/
temperature sensitivity
1,2,3
All
All
-10
10
DVIO
DT
/
±VS = ±20 V, VCM = 0 V
±VS = ±20 V, VCM = 0 V
mV/°C
Input offset 3/ 4/ 5/
current
IIO
1
2,3
1
-20
-20
20
20
pA
nA
M,D,P,L,R 1/
-0.3
-100
-10
0.3
3500
60
Input bias 3/ 4/ 5/
current
+IIB ,
-IIB
1
All
pA
nA
nA
pA
nA
pA
nA
±VS = ±20 V,
2
VCM = +15 V, t £ 25 ms
M,D,P,L,R 1/
1
-3.0
-100
-10
3.0
300
60
1
±VS = ±15 V,
2
VCM = +10 V, t £ 25 ms
±VS = ±20 V,
1
-100
-10
100
50
-15 V < VCM < 0 V,
t £ 25 ms
2
Adjustment for input 2/
offset voltage
+VIO
ADJ,
-VIO
1,2,3
All
+8
-8
mV
±VS = ±20 V
ADJ
VOP
Output voltage swing 2/
(maximum)
1,2,3
1,2,3
All
All
V
±VS = ±20 V, RL = 10 kW
±VS = ±20 V, RL = 2 kW
±16
±15
-50
Output short circuit 2/ 6/
current
+IOS
-IOS
mA
±VS = ±15 V, t £ 25 ms,
short circuit to ground
50
See footnotes at end of table.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-98636
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
A
5
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C £ TA £ +125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits
Max
Unit
Test
Symbol
Min
Supply current
IS
1,2
3
01
02
01
02
01
02
All
4
mA
±VS = ±15 V
7
6
11
4
M,D,P,L,R 1/
1
7
Open loop voltage 7/
gain (single ended)
4
50
25
V/mV
V/mV
±AVS
±VS = ±20 V, RL = 2 kW
VOUT = ±15 V
5,6
M,D,P,L,R 1/
VS = ±5 V, RL = 2 kW,
VOUT = ±2 V
4
50
10
Open loop voltage 2/ 7/
gain (single ended)
AVS
4,5,6
All
Noise (referred to input) 2/
broadband
NI(BB)
NI(PC)
±SR
4
4
4
All
All
10
40
±VS = 20V,
mVrms
mVPK
V/ms
bandwidth = 5 kHz
Noise (referred to input) 2/
popcorn
±VS = 20 V,
bandwidth = 5 kHz
Slew rate 2/
01
02
01
02
All
3
10
1.5
7
±VS = ±15 V, VIN = ±5 V,
AV = 1
5,6
Power supply rejection 2/
ratio
+PSRR
-PSRR
CMR
+VS = 10 V, -VS = -20 V
+VS = 20 V, -VS = -10 V
±VS = ±20 V, VIN = ±15 V
4,5,6
4,5,6
85
85
85
dB
dB
Input voltage common 2/ 8/
mode rejection
All
See footnotes at end of table.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-98636
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
A
6
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C £ TA £ +125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits
Max
Unit
Test
Symbol
Min
Transient response 2/
rise time
TR(tr)
9,10,11
01
150
ns
±VS = ±15 V, RL = 2 kW,
CL = 100 pF, VIN = 50 mV,
AV = 1
02
100
40
Transient response 2/
overshoot
TR(os)
9,10,11
9
01,02
%
±VS = ±15 V, RL = 2 kW,
CL = 100 pF, VIN = 50 mV,
AV = 1
Settling time 2/
+ts,
-ts
All
1500
ns
±VS = ±15 V, 0.1 % error,
AV = -1
1/ Devices supplied to this drawing have been characterized through all levels M, D, P, L, and R of irradiation. However,
this device is only tested at the "R" level. Pre and Post irradiation values are identical unless otherwise specified
in table I. When performing post irradiation electrical measurements for any RHA level, TA = +25°C. ±VS = ±15 V.
2/ This parameter is not tested to post irradiation.
3/ Bias and offset currents are actually junction leakage currents which double (approximately) for each 10°C increase in
junction temperature (TJ). Measurement of bias and offset current is specified at TJ rather than TA, since normal warmup
thermal transients will affect the bias and offset currents. The measurements for bias currents must be made within
25 ms or 5 loop time constants which ever is greater, after power is first applied to the device for test. Measurement at
TA = -55°C is not necessary since expected values are too small for typical test systems.
4/ Bias current is sensitive to power supply voltage, common mode voltage and temperature.
5/ Negative IIB minimum limits reflect the characteristics of devices with bias current compensation.
6/ Continuous limits shall be considerably lower. Protection for shorts to either supply exists providing
that TJ(maximum) £ 175°C.
7/ Because of thermal feedback effects from output to input, open loop gain is not guaranteed to be linear or positive over
the operating range. These requirements, if needed, should be specified by the user in additional procurement
documents.
8/ CMR is calculated from VIO measurements at VCM = +15 V and -15 V.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein)
involving devices acquired to this drawing is required for any change as defined in MIL-STD-973.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available
onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 61 (see MIL-PRF-38535, appendix A).
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-98636
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
A
7
DSCC FORM 2234
APR 97
Device types
Case outlines
Terminal number
All
G and P
Terminal symbol
BALANCE
-INPUT
+INPUT
-VS
1
2
3
4
5
6
7
8
BALANCE
OUTPUT
+VS
NC
NC = No connection
FIGURE 1. Terminal connections.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-98636
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
A
8
DSCC FORM 2234
APR 97
FIGURE 2. Radiation exposure circuit.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-98636
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
A
9
DSCC FORM 2234
APR 97
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-
PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not
affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance
with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on
all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with
method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4.2.1 Additional criteria for device class M.
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test
method 1015.
(2) TA = +125°C, minimum.
b. Interim and final electrical test parameters shall be as specified in table IIA herein.
4.2.2 Additional criteria for device classes Q and V.
a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device
manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document
revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test
method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table IIA herein.
c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups
A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with
MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein except where option 2 of
MIL-PRF-38535 permits alternate in-line control testing. Quality conformance inspection for device class M shall be in accordance
with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified
in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4.1 Group A inspection.
a. Tests shall be as specified in table IIA herein.
b. Subgroups 7 and 8 in table I, method 5005 of MIL-STD-883 shall be omitted.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-98636
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
A
10
DSCC FORM 2234
APR 97
TABLE IIA. Electrical test requirements.
Subgroups
Test requirements
Subgroups
(in accordance with
MIL-STD-883,
(in accordance with
MIL-PRF-38535, table III)
method 5005, table I)
Device
class M
Device
class Q
Device
class V
Interim electrical
1
1
1
parameters (see 4.2)
Final electrical
parameters (see 4.2)
1,2,3,4, 1/
5,6
1,2,3,4, 1/
5,6
1,2,3,4, 1/ 2/
5,6
Group A test
requirements (see 4.4)
1,2,3,4,5,6,
9,10,11
1
1,2,3,4,5,6,
9,10,11
1
1,2,3,4,5,6,
9,10,11
Group C end-point electrical
parameters (see 4.4)
1,2,3 2/
Group D end-point electrical
parameters (see 4.4)
1
1
1,2,3
---
Group E end-point electrical
parameters (see 4.4)
---
---
1/ PDA applies to subgroup 1.
2/ See table IIB for delta measurement parameters.
TABLE IIB. 240 hour burn-in and group C end point electrical parameters. (TA = +25°C)
Parameter
Device type
Limits
Delta
Units
Min
-2
-100
-100
Max
2
100
100
Min
-0.5
-50
-50
Max
+0.5
+50
+50
VIO
+IIB
-IIB
All
All
All
mV
pA
pA
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:
a. Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control
and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs,
outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-
STD-883.
b. TA = +125°C, minimum.
c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or
approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test
circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-
STD-883.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-98636
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
A
11
DSCC FORM 2234
APR 97
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured
(see 3.5 herein). RHA levels for device classes M, Q, and V shall be as specified in MIL-I-38535. End-point electrical parameters
shall be as specified in table IIA herein.
4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883 method
1019 and as specified herein.
4.4.4.1.1 Accelerated aging test. Accelerated aging tests shall be performed on all devices requiring a RHA level greater than 5k
rads(Si). The post-anneal end-point electrical parameter limits shall be as specified in table I herein and shall be the pre-irradiation
end-point electrical parameter limit at 25°C ±5°C. Testing shall be performed at initial qualification and after any design or process
changes which may affect the RHA response of the device.
4.4.4.2 Dose rate burnout. When required by the customer test shall be performed on devices, SEC, or approved test structures
at technology qualifications and after any design or process changes which may effect the RHA capability of the process. Dose rate
burnout shall be performed in accordance with test method 1023 of MIL-STD-883 and as specified herein.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q
and V or MIL-PRF-38535, appendix A for device class M.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original
equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared
specification or drawing.
6.1.2 Substitutability. Device class Q devices will replace device class M devices.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the
individual documents. This coordination will be accomplished in accordance with MIL-STD-973 using DD Form 1692, Engineering
Change Proposal.
6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus when a system application
requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users and this list will
be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC
5962) should contact DSCC-VA, telephone (614) 692-0525.
6.4 Comments. Comments on this drawing should be directed to DSCC-VA , Columbus, Ohio 43216-5000, or telephone
(614) 692-0674.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-1331.
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The
vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to this
drawing.
6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The
vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to
and accepted by DSCC-VA.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-98636
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
A
12
DSCC FORM 2234
APR 97
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 99-10-25
Approved sources of supply for SMD 5962-98636 are listed below for immediate acquisition information only and shall
be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised
to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of
compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revision of
MIL-HDBK-103 and QML-38535.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962R9863601VGA
5962R9863601VPA
5962R9863602VGA
5962R9863602VPA
24355
24355
24355
24355
PM155AJ/QMLR
PM155AZ/QMLR
PM156AJ/QMLR
PM156AZ/QMLR
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed, contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
Vendor CAGE
number
Vendor name
and address
24355
Analog Devices
RT 1 Industrial Park
P.O. Box 9106
Norwood, MA 02062
Point of contact: 1500 Space Park Drive
P.O. Box 58020
Santa Clara, CA 95050-8020
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
相关型号：
©2020 ICPDF网 联系我们和版权申明