LPW272-0729-20AC01L [ACTEL]
IC Socket, BGA272, 272 Contact(s),;型号: | LPW272-0729-20AC01L |
厂家: | Actel Corporation |
描述: | IC Socket, BGA272, 272 Contact(s), |
文件: | 总4页 (文件大小:1210K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
EP patents 0829188, 0897655
Patents pending in other countries.
Ball / Land Grid Array Sockets
Screw Lock Type
E-tec
the Swiss connection
E-tec is now the leading BGA socket manufacturer.
Sockets range from 5 x 5 upwards contacts with even larger parts
currently in design. Some of the existing patterns are shown on the
following pages, many more exist and your exact requirements can easily
be added to our extensive product library. The SMD socket is simply
placed and reflowed onto the PCB in the same way as the chip and
occupies only a small amount of additional board space. The screw lock
socket extends ≈ 6,00 mm beyond the outer ballrow with no fixing holes.
We aim to solve your requirements - many different terminals and
configurations are available. Your custom sets our standards!
Please note, we will always request the chip data
to ensure we offer a compatible socket.
SMT Style
PCB Pad Layout
Ø 0,70mm/.028“ if pitch 1,27mm
Ø 0,60mm/.023“ if pitch 1,00mm
Ø 0,50mm/.019“ if pitch 0,80mm
dimensions if BGA Socket pitch 1,27mm with contact type 30
Specifications
Soldertail Style
Mechanical data
Contact life
Retention System life
Solderability
100000 cycles min.
100 cycles min.
exceeds MIL-STD-202 Method 208
Soldertail:
Ø 0,45mm/.017“ if pitch 1,27mm
Ø 0,45mm/.017“ if pitch 1,00mm
Ø 0,40mm/.015“ if pitch 0,80mm
Individual contact force
Max. torque for retention screws
40 grams max.
7 cN per meter, or 10oz per inch
Material
Insulator
Terminal
Contact
Glass Epoxy FR 4
Brass
BeCu
PCB Hole Layaut
PCB Hole:
Electrical data
Contact resistance
Current rating
Insulation resistance at 500V DC
Breakdown voltage at 60 Hz
Inductance
Ø 0,60mm/.024“ if pitch 1,27mm
Ø 0,60mm/.024“ if pitch 1,00mm
Ø 0,55mm/.021“ if pitch 0,80mm
< 30 mΩ
1 A max.
>104 MΩ
1 KV min.
< 5 nH
The pitch dimension depends on your Ball Grid Array
Operating temperature
−55°C to +130°C ; 220°C for 10 sec.
How to order
X X W x x x x - x x x x - x x X X x x
Device Type
Device Material
Pitch
Grid Code Config Code
Plating
07 = 0,75mm
08 = 0,80mm
10 = 1,00mm
12 = 1,27mm
15 = 1,50mm
B
L
C
=
=
=
Ball Grid
please refer to
the footprint
pages
will be given by
the factory after
receipt of the chip
datasheet
01 = tin/gold
C
P
=
=
Ceramic
Plastic
Land Grid
Column Grid
42 to 50
Nbr of contacts
Contact Type
30 = standard SMD ( „A“ = 1,20mm if 1,27mm pitch; 0,80mm if 1,00mm & 0,80mm pitch )
refer to the next pages
29 = raised SMD
70 = solder tail
( „A“ = 5,00mm; other dim. on request )
( „A“ = 3,30mm if 1,27mm pitch; 2,80mm if 1,00mm & 0,80mm pitch )
38
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