AK632512G [ACCUTEK]
524,288 x 32 Bit CMOS / BiCMOS Static Random Access Memory; 524288 ×32位CMOS / BiCMOS工艺中的静态随机存取存储器
| 型号： | AK632512G |
| 厂家： | 
ACCUTEK MICROCIRCUIT CORPORATION |
| 描述： | 524,288 x 32 Bit CMOS / BiCMOS Static Random Access Memory |
| 文件： | 总2页 (文件大小：99K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Accutek
Microcircuit
Corporation
AK632512W / AK632512Z
524,288 x 32 Bit CMOS / BiCMOS
Static Random Access Memory
DESCRIPTION
Front View
72-Pin SIM
The Accutek AK632512 SRAM Module consists of fast high perfor-
mance SRAMs mounted on a low height, 72 pin SIM or ZIP Board.
The module utilizes four 36 pin 512K x 8 SRAMs in 400 mil SOJ
packages and four decoupling capacitors mounted on the front side
of a printed circuit board.
37
72
1
36
The SRAMs used have common I/O functions and single output en-
able functions. Also, four separate chip select (CE) connections are
used to independently enable the four bytes. The modules can be
supplied in a variety of access time values from 15 nSEC to
35 nSEC in CMOS or BiCMOS technology.
72-Pin ZIP
The Accutek module is designed to have a maximum seated height
of 0.640 inch SIM or 0.555 inch ZIP to provide for the lowest height
off the board. Each conforms to JEDEC-standard sizes and pin-out
configurations. Using four pins for module memory density identifi-
cation, PD0, PD1, PD2 and PD3 minimizes interchangeability and
design considerations when changing from one module size to the
other in customer applications.
1
36
37
72
· Presence Detect, PD0, PD1, PD2 and PD3 for identifying module
density
· Downward compatible with 256K x 32 (AK632256), 128K x 32
(AK632128), 64K x 32 (AK63264) and 32K x 32 (AK63232), 64
pin SIM or ZIP designs
FEATURES
· 524,288 x 32 bit organization
· Upward compatible with 1 Meg x 32 (AK6321024)
· Single 5 volt power supply - AK632512W, AK632512Z
· JEDEC Standard 72 pin SIM or ZIP format
· Common I/O, single OE and WE functions with four separate
chip selects (CE)
· Single 3.3 volt power supply - AK632512W/3.3,
AK632512Z/3.3
· Operating free air temperature 00 to 700C
· Fast access times from 15 nSEC
· Low height, 0.640 inch SIM or 0.555 inch ZIP maximum
· Power:
ELECTRICAL SPECIFICATIONS
720mA Max Active (20 nSEC)
760mA Max Active (15 nSEC)
800mA Max Active (12 nSEC)
200mA Max Standby
Timing diagrams and basic electrical characteristics are those of the
standard 512K x 8 SRAMs used to construct these modules.
Accutek’s module design allows the flexibility of selecting indus-
try-compatible 512K x 8 SRAMs from several SRAM manufacturers.
· TTL-compatible inputs and outputs
PIN NOMENCLATURE
PIN ASSIGNMENT
FUNCTIONAL DIAGRAM
PIN #
1
SYMBOL
NC
PIN #
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
SYMBOL
A1
PIN #
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
SYMBOL
CE4
CE3
A17
PIN #
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
SYMBOL
A5
A0 - A18
WE
+
+
A0 - A18
WE
A0 - A18
CE1 - CE4
DQ1 - DQ32
OE
Address Inputs
19
*
*
+
+
+
+
DQ1 - DQ8
DQ1 - DQ8
DQ1 - DQ8
DQ1 - DQ8
Chip Enable
Data In/Data Out
Output Enable
Presence Detect
5v Supply
2
NC
A8
A12
OE
+
+
OE
3
PD2
PD3
Vss
A2
Vcc
CE
4
A9
A16
A13
CE1
5
DQ13
DQ5
DQ14
DQ6
DQ15
DQ7
DQ16
DQ8
Vss
OE
A6
A0 - A18
WE
6
PD0
PD1
DQ1
DQ9
DQ2
DQ10
DQ3
DQ11
DQ4
DQ12
Vcc
Vss
DQ21
DQ29
DQ22
DQ30
DQ23
DQ31
DQ24
DQ32
Vss
PD0 - PD3
Vcc
*
*
7
DQ25
DQ17
DQ26
DQ18
DQ27
DQ19
DQ27
DQ20
A3
DQ9 - DQ16
DQ17 - DQ24
DQ25 - DQ32
8
OE
Vss
Ground
9
CE
CE2
CE3
CE4
+
+
+
10
11
12
13
14
15
16
17
18
WE
Write Enable
A0 - A18
WE
*
*
MODULE OPTIONS
OE
WE
CE
Leadless SIM: AK632512W
Leaded SIP: AK632512G
Leaded ZIP: AK632512Z
A15
A14
CE2
CE1
A18
A10
NC
A0 - A168
WE
A0
A4
NC
*
*
A7
A11
NC
DQ1 - DQ8
OE
PD0
PD1
=
=
Open
Open
PD2
PD3
=
=
Vss
Open
CE
ORDERING INFORMATION
MECHANICALDIMENSIONS
Inches
PARTNUMBERCODINGINTERPRETATION
1
2
3
4
5
6
7
8
Position
1
Product
AK
= AccutekMemory
2
Type
4 = DynamicRAM
5 = CMOS Dy namic RAM
6 = Static RAM
3
Organization/WordWidth
1 = by 1 16 = by 16
4 = by 4 32 = by 32
8 = by 8 36 = by 36
9 = by 9
4
Size/Bits Depth
64 = 64K
256 = 256K
4096 = 4 MEG
8192 = 8 MEG
1024 = 1 MEG 16384 = 16 MEG
5
PackageType
G = Sin gle In-Line Pack age (SIP)
S = Sin gle In-Line Mod ule (SIM)
D = Dual In-Line Pack age (DIP)
W = .050 inch Pitch Edge Con nect
Z = Zig-Zag In-Line Pack age (ZIP)
6
SpecialDesignation
P = Page Mode
N = Nib ble Mode
K = Static Col umn Mode
W = Write Per Bit Mode
V = Video Ram
7
Separator
- = Commercial00C to +700C
M = MilitaryEquivalentScreened
(-550C to +1250C)
I
= IndustrialTemperatureTested
(-450C to +850C)
X = Burned In
8
Speed(firsttwosignificantdigits)
DRAMS
SRAMS
50
60
70
80
=
=
=
=
50 nS
60 nS
70 nS
80 nS
8
10
12
15
=
=
=
=
8 nS
10 nS
25 nS
15 nS
The num bers and cod ing on this page do not in clude all vari a tions
avail able but are shown as ex am ples of the most widely used
variations. ContactAccutekifotherinformationisrequired.
EXAMPLES:
AK632512W-15
512K x 32, 15 nSEC SRAM Mod ule, SIM Con fig u ra tion
AK632512Z-20
512K x 32, 20 nSEC SRAM Mod ule, ZIP Con fig u ra tion
Accutekreservestherighttomakechangesinspecificationsatany
timeandwithoutnotice. Accutekdoesnotassumeanyresponsibility
for the use of any cir cuitry de scribed; no cir cuit pat ent li censes are
implied. Pre lim i nary data sheets con tain min i mum and max i mum
limits based upon design objectives, which are sub ject to change
uponfullcharacterizationoverthespecificoperatingconditions.
ACCUTEKMICROCIRCUITCORPORATION
BUSI NESS CENTER at NEWBURYPORT
2 NEW PAS TURE ROAD, SUITE 1
NEWBURYPORT, MA 01950-4054
VOICE:
Email:
978-465-6200
sales@accutekmicro.com
FAX: 978-462-3396
Internet:
www.accutekmicro.com
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