374524B60023 [AAVID]
Solder Anchor Attachment Method; 焊锡锚固定方法型号: | 374524B60023 |
厂家: | AAVID THERMALLOY, LLC |
描述: | Solder Anchor Attachment Method |
文件: | 总3页 (文件大小:115K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Standard Products Found
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Solder Anchor Attachment Method
Part Number: 374524B60023
(Vis Number: 037811)
This part is in stock and available for immediate delivery:
Contact your local sales rep
BGA Surface Interface Heat Sink Finish Part Class
All
T766
Black Anodize
A
Features and Benefits
• New unique wire clip design allows for complete reworkability
after assembly
• Configurations are available for a wide range of BGA package
sizes in any thickness up to 3.0mm
• Minimal PC Board real estate is required for mounting
• Solder Anchors provide the most rugged mounting in the
industry
• Each Heat Sink utilizes a phase change pad as the interface for
optimal performance
Solder anchors are sold separately
Part Number Do57
2 Solder anchors must be soldered to the PCB Prior to
attaching the heat sink clip.
Fin Thickness Fin Thickness
Across Width Across Length
# of fins
across width across length
# of fins
Width Length Height
Base Thickness
2.05mm
27mm 27mm 25mm 1.9mm
2.04mm
6
6
Mechanical Outline Drawing
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Standard Products Found
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Unless otherwise shown, tolerances are ±0.38(±.015)
Recommended PCB Hole Pattern
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Standard Products Found
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Thermal Performance
*θn **θf
16.5 5.47
*Natural convection thermal resistance is based on a 75 °C heat sink temperature rise.
**Forced convection thermal resistance based on an entering 1.0 m/s (200 lfm) airflow.
Due to various heat dissipation paths within a BGA device, please test the heat sink in your application.
This data sheet represents only one of a broad range of products we make to cool electronics.
Our representatives can help you configure a complete cooling solution for your individual applications.
Visit us at www.aavidthermalloy.com • info@aavid.com • ©2002 Aavid Thermalloy, LLC
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