341600F00000G [AAVID]
Heat Sink, Adhesive, Copper, ROHS COMPLIANT;
| 型号： | 341600F00000G |
| 厂家： | 
AAVID THERMALLOY, LLC |
| 描述： | Heat Sink, Adhesive, Copper, ROHS COMPLIANT 装置 耐热支撑装置 |
| 文件： | 总2页 (文件大小：191K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
21/05/2012
341600F00000G - heatsinks for BGA Devices
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341600F00000G
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Low profile copper heat sink for PCI and AGP chip sets
When space is at a premium, Aavid’s Thin-fin heat sinks reduce package case temperature by as
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much as 20ºC. These flexible, copper spreaders attach to the electronic package using pre-
applied adhesive, providing an off-theshelf solution for PCI and AGP chip sets. A laminated
dielectric coating prevents shorting,making the Thin-Fin ideal for BGA devices and multimedia
applications.
RoHS:
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Width: 12.70
Length: 50.80
Height: 0.00
Thermal Performance
(based on a heatsink temperature rise of 75°C above ambient)
based on fully ducted airflow entering at 1.0 m/s (197 LFM).
Thermal Curve:
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21/05/2012
341600F00000G - heatsinks for BGA Devices
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Aavid will lead the electronics thermal management industry worldwide. We will be the first company customers call to enable their thermal designs anywhere in the world. We will respond with
extraordinary speed and will provide them with timely and cost-effective solutions because we understand their needs, their industry, and their culture. 2012 Aavid Thermalloy, LLC
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