AP70U02GH [A-POWER]
Simple Drive Requirement, Low On-resistance; 简单的驱动要求,低导通电阻型号: | AP70U02GH |
厂家: | ADVANCED POWER ELECTRONICS CORP. |
描述: | Simple Drive Requirement, Low On-resistance |
文件: | 总5页 (文件大小:131K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
AP70U02GH
Preliminary
Advanced Power
Electronics Corp.
N-CHANNEL ENHANCEMENT MODE
POWER MOSFET
D
S
▼ Simple Drive Requirement
BVDSS
RDS(ON)
ID
25V
9mΩ
60A
▼ Low On-resistance
▼ Fast Switching Characteristic
▼ RoHS Compliant
G
Description
G
D
S
The Advanced Power MOSFETs from APEC provide the designer with
the best combination of fast switching, ruggedized device design, low
on-resistance and cost-effectiveness.
TO-252(H)
The TO-252 package is universally preferred for all commercial-
industrial surface mount applications and suited for low voltage
applications such as DC/DC converters.
Absolute Maximum Ratings
Symbol
Parameter
Rating
25
Units
V
VDS
VGS
Drain-Source Voltage
Gate-Source Voltage
± 20
V
Continuous Drain Current, VGS @ 10V
ID@TC=25℃
ID@TC=100℃
IDM
60
A
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current1
41
A
220
A
PD@TC=25℃
Total Power Dissipation
47
W
Linear Derating Factor
0.31
W/℃
℃
℃
TSTG
TJ
Storage Temperature Range
Operating Junction Temperature Range
-55 to 175
-55 to 175
Thermal Data
Symbol
.
Value
Units
℃/W
℃/W
Rthj-c
Thermal Resistance Junction-case
Thermal Resistance Junction-ambient
Max.
Max.
3.2
Rthj-a
110
Data and specifications subject to change without notice
200831071pre-1/4
AP70U02GH
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol
BVDSS
RDS(ON)
Parameter
Test Conditions
Min. Typ. Max. Units
Drain-Source Breakdown Voltage
Static Drain-Source On-Resistance2 VGS=10V, ID=40A
VGS=0V, ID=250uA
25
-
-
-
-
-
V
9
mΩ
mΩ
V
GS=4.5V, ID=30A
-
15
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=250uA
VDS=10V, ID=40A
VDS=25V, VGS=0V
VGS= ±20V
ID=40A
1
-
-
-
-
-
-
-
-
-
-
-
-
-
-
39
3
V
gfs
Forward Transconductance
-
S
IDSS
IGSS
Drain-Source Leakage Current
uA
nA
nC
nC
nC
ns
ns
ns
ns
pF
pF
pF
-
1
Gate-Source Leakage
Total Gate Charge2
Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time2
Rise Time
-
±100
Qg
18.5
3.7
12.1
8.3
102
24
30
-
Qgs
Qgd
td(on)
tr
VDS=20V
VGS=4.5V
-
VDS=15V
-
ID=40A
-
td(off)
tf
Turn-off Delay Time
Fall Time
RG=3.3Ω,VGS=10V
RD=0.375Ω
VGS=0V
-
12
-
Ciss
Coss
Crss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
1360 2180
VDS=25V
202
198
-
-
f=1.0MHz
Source-Drain Diode
Symbol
Parameter
Test Conditions
Min. Typ. Max. Units
VSD
trr
Forward On Voltage2
Reverse Recovery Time2
IS=30A, VGS=0V
IS=20A, VGS=0V,
dI/dt=100A/µs
-
-
-
-
1.2
V
ns
nC
30
25
-
-
Qrr
Reverse Recovery Charge
Notes:
1.Pulse width limited by max. junction temperature.
2.Pulse test
THIS PRODUCT IS AN ELECTROSTATIC SENSITIVE, PLEASE HANDLE WITH CAUTION.
THIS PRODUCT HAS BEEN QUALIFIED FOR CONSUMER MARKET. APPLICATIONS OR USES AS CRITERIAL COMPONENT IN LIFE SUPPORT
DEVICE OR SYSTEM ARE NOT AUTHORIZED.
2/4
AP70U02GH
100
80
60
40
20
0
150
120
90
60
30
0
T C =175 o
C
T C =25 o
C
10V
10V
7.0V
5.0V
4.5V
7.0V
5.0V
4.5V
V G =3.0V
V G =3.0V
0
1
2
3
4
5
6
0
1
2
3
4
5
6
V DS , Drain-to-Source Voltage (V)
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
15
13
11
9
1.8
1.4
1
I D = 30 A
T
C =25 ℃
I D =40A
V
G =10V
Ω
7
5
0.6
2
4
6
8
10
-50
0
50
100
150
200
T j , Junction Temperature ( o C)
VGS , Gate-to-Source Voltage (V)
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
1.8
1.2
0.6
0.0
40
30
20
10
0
T j =175 o
C
T j =25 o
C
0
0.2
0.4
0.6
0.8
1
1.2
1.4
-50
0
50
100
150
200
V SD , Source-to-Drain Voltage (V)
T j , Junction Temperature ( o C )
Fig 5. Forward Characteristic of
Reverse Diode
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
3/4
AP70U02GH
f=1.0MHz
12
10000
1000
100
I D = 40 A
9
V DS = 12 V
V
DS = 15 V
V
DS = 20 V
C iss
6
3
0
C oss
C rss
0
10
20
30
40
1
5
9
13
17
21
25
29
Q G , Total Gate Charge (nC)
V DS , Drain-to-Source Voltage (V)
Fig7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
1000
100
10
1
Duty factor=0.5
0.2
0.1
100us
0.1
0.05
1ms
10ms
100ms
PDM
0.02
t
T
0.01
1
T c =25 o
C
1s
DC
Duty factor = t/T
Single Pulse
Peak Tj = PDM x Rthjc + TC
Single Pulse
0
0.01
0.00001
0.1
1
10
100
0.0001
0.001
0.01
0.1
1
10
V DS , Drain-to-Source Voltage (V)
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig10. Effective Transient Thermal Impedance
VG
VDS
90%
QG
4.5V
QGD
QGS
10%
VGS
t
td(on) tr
d(off) tf
Q
Charge
Fig 11. Switching Time Waveform
Fig 12. Gate Charge Waveform
4/4
ADVANCED POWER ELECTRONICS CORP.
Package Outline : TO-252
Millimeters
D
SYMBOLS
MIN
NOM MAX
D1
A2
A3
B1
D
1.80
0.40
0.40
6.00
4.80
3.50
2.20
0.5
2.30
0.50
0.70
6.50
5.35
4.00
2.63
0.85
5.70
1.10
2.30
0.50
2.80
0.60
1.00
7.00
5.90
4.50
3.05
1.20
6.30
1.80
--
E2
D1
E3
F
E3
F1
E1
E2
e
E1
5.10
0.50
--
C
0.35
0.65
B1
F1
F
1.All Dimensions Are in Millimeters.
e
e
2.Dimension Does Not Include Mold Protrusions.
R : 0.127~0.381
A2
(0.1mm
C
A3
Part Marking Information & Packing : TO-252
Part Number
Package Code
meet Rohs requirement
70U02GH
LOGO
Date Code (YWWSSS)
YWWSSS
Y:Last Digit Of The Year
WW:Week
SSS:Sequence
相关型号:
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