AP6680SGYT-HF [A-POWER]

Simple Drive Requirement, Small Size & Lower Profile; 简单的驱动要求,小尺寸和更低的简介
AP6680SGYT-HF
型号: AP6680SGYT-HF
厂家: ADVANCED POWER ELECTRONICS CORP.    ADVANCED POWER ELECTRONICS CORP.
描述:

Simple Drive Requirement, Small Size & Lower Profile
简单的驱动要求,小尺寸和更低的简介

驱动
文件: 总4页 (文件大小:65K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
AP6680SGYT-HF  
Halogen-Free Product  
Advanced Power  
Electronics Corp.  
N-CHANNEL MOSFET WITH SCHOTTKY  
DIODE  
D
S
Simple Drive Requirement  
BVDSS  
RDS(ON)  
ID  
30V  
9mΩ  
15A  
Small Size & Lower Profile  
Schottky Diode  
RoHS Compliant & Halogen-Free  
G
D
D
Description  
D
AP6680S series are from Advanced Power innovated design and silicon  
process technology to achieve the lowest possible on-resistance and fast  
switching performance. It provides the designer with an extreme efficient  
device for use in a wide range of power applications.  
The PMPAK® 3x3 package is special for voltage conversion application  
using standard infrared reflow technique with the backside heat sink to  
achieve the good thermal performance.  
D
S
S
S
G
PMPAK® 3x3  
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
30  
Units  
VDS  
VGS  
Drain-Source Voltage  
V
V
Gate-Source Voltage  
+20  
ID@TA=25  
ID@TA=70℃  
IDM  
Continuous Drain Current3  
Continuous Drain Current3  
Pulsed Drain Current1  
15  
A
12  
A
50  
A
PD@TA=25℃  
TSTG  
Total Power Dissipation  
3.13  
W
Storage Temperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
TJ  
Thermal Data  
Symbol  
Parameter  
Value  
Unit  
/W  
/W  
Rthj-c  
Maximum Thermal Resistance, Junction-case  
Maximum Thermal Resistance, Junction-ambient3  
5
Rthj-a  
40  
Data and specifications subject to change without notice  
1
201206211  
AP6680SGYT-HF  
Electrical Characteristics@Tj=25oC(unless otherwise specified)  
Symbol  
BVDSS  
RDS(ON)  
Parameter  
Test Conditions  
Min. Typ. Max. Units  
Drain-Source Breakdown Voltage  
Static Drain-Source On-Resistance2 VGS=10V, ID=12A  
VGS=0V, ID=250uA  
30  
-
-
6.7  
11.2  
1.45  
20  
-
-
V
mΩ  
mΩ  
V
9
VGS=4.5V, ID=8A  
-
15  
VGS(th)  
Gate Threshold Voltage  
Forward Transconductance  
Drain-Source Leakage Current  
Gate-Source Leakage  
Total Gate Charge  
VDS=VGS, ID=250uA  
VDS=10V, ID=12A  
VDS=24V, VGS=0V  
VGS=+20V, VDS=0V  
ID=12A  
1
-
3
gfs  
-
S
IDSS  
IGSS  
uA  
nA  
nC  
nC  
nC  
ns  
-
100  
-
-
+100  
Qg  
-
10  
3
16  
-
Qgs  
Qgd  
td(on)  
tr  
Gate-Source Charge  
Gate-Drain ("Miller") Charge  
Turn-on Delay Time  
Rise Time  
VDS=15V  
-
VGS=4.5V  
-
5
-
VDS=15V  
-
10  
6
-
ns  
ID=1A  
-
-
ns  
td(off)  
tf  
Turn-off Delay Time  
Fall Time  
RG=3.3Ω  
-
22  
6.5  
-
ns  
VGS=10V  
-
-
pF  
pF  
pF  
Ω
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
VGS=0V  
-
1000 1600  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
VDS=15V  
-
225  
150  
1.9  
-
-
f=1.0MHz  
-
f=1.0MHz  
-
3.8  
Source-Drain Diode  
Symbol  
Parameter  
Test Conditions  
Min. Typ. Max. Units  
VSD  
trr  
Diode+Schottky Forward On Voltage2 IS=1.0A, VGS=0V  
-
-
-
0.48  
18  
8
0.5  
V
Body Diode+Schottky Reverse Recovery Time IS=12A, VGS=0V,  
-
-
ns  
nC  
Qrr  
Body Diode+Schottky Reverse Recovery Charge dI/dt=100A/µs  
Notes:  
1.Pulse width limited by Max. junction temperature.  
2.Pulse test  
3.Surface mounted on 1 in2 2oz copper pad of FR4 board, t <10sec ; 210oC/W when mounted on min. copper pad.  
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.  
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.  
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED  
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE  
RELIABILITY, FUNCTION OR DESIGN.  
2
AP6680SGYT-HF  
50  
40  
30  
20  
10  
0
50  
40  
30  
20  
10  
0
A =25 o C  
T A = 150 o  
C
10V  
7.0V  
6.0V  
10V  
7.0V  
6.0V  
T
5.0V  
5.0V  
V G = 4.0V  
V
G = 4.0V  
0
1
2
3
4
5
6
0
1
2
3
4
5
V DS , Drain-to-Source Voltage (V)  
V DS , Drain-to-Source Voltage (V)  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
16  
14  
12  
10  
8
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
I D =12A  
I D = 8 A  
V
G =10V  
T
A =25  
Ω
6
2
4
6
8
10  
-50  
0
50  
100  
150  
T j , Junction Temperature ( o C)  
V GS , Gate-to-Source Voltage (V)  
Fig 3. On-Resistance v.s. Gate Voltage  
Fig 4. Normalized On-Resistance  
v.s. Junction Temperature  
12  
10  
8
2.0  
1.6  
1.2  
0.8  
0.4  
0.0  
I D =10mA  
T j =150 o C  
T j =25 o C  
6
4
2
0
-50  
0
50  
100  
150  
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
T j , Junction Temperature ( o C)  
V SD , Source-to-Drain Voltage (V)  
Fig 5. Forward Characteristic of  
Reverse Diode  
Fig 6. Gate Threshold Voltage v.s.  
Junction Temperature  
3
AP6680SGYT-HF  
f=1.0MHz  
C iss  
1200  
1000  
800  
600  
400  
200  
0
10  
I D = 12 A  
V
DS =15V  
8
6
4
2
0
C oss  
C rss  
0
4
8
12  
16  
20  
1
5
9
13  
17  
21  
25  
29  
Q G , Total Gate Charge (nC)  
V DS , Drain-to-Source Voltage (V)  
Fig 7. Gate Charge Characteristics  
Fig 8. Typical Capacitance Characteristics  
1
100  
Duty factor=0.5  
Operation in this  
area limited by  
RDS(ON)  
0.2  
0.1  
100us  
10  
0.1  
1ms  
0.05  
0.02  
1
10ms  
PDM  
100ms  
0.01  
0.01  
t
T
0.1  
1s  
Duty factor = t/T  
T A =25 o C  
Peak Tj = PDM x Rthja + Ta  
Single Pulse  
Rthia=210 /W  
Single Pulse  
DC  
0.001  
0.0001  
0.01  
0.001  
0.01  
0.1  
1
10  
100  
1000  
0.01  
0.1  
1
10  
100  
t , Pulse Width (s)  
V DS , Drain-to-Source Voltage (V)  
Fig 9. Maximum Safe Operating Area  
Fig 10. Effective Transient Thermal Impedance  
20  
16  
12  
8
VG  
QG  
4.5V  
QGS  
QGD  
4
Charge  
Q
0
25  
50  
75  
100  
125  
150  
T A , Ambient Temperature ( o C )  
Fig 11. Maximum Continuous Drain  
Current v.s. Ambient Temperature  
Fig 12. Gate Charge Waveform  
4

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